Ajou University repository

  • Add filters:
  • Results/Page
  • Sort by
  • In order
  • Authors/record

Showing results 1 to 10 of 527 (Search time: 0.0 seconds).

Community Name
Department of Intelligence Semiconductor Engineering
Department of Intelligence Semiconductor Engineering
Rapid 3d-imaging of semiconductor chips using thz time-of-flight techniqueoa mark
  • Yim, Jong Hyuk;
  • Kim, Su Yeon;
  • Kim, Yiseob;
  • Cho, Suyoung;
  • Kim, Jangsun;
  • Ahn, Yeong Hwan
  • 2021-06-01
  • Applied Sciences (Switzerland), Vol.11
  • MDPI AG
Virtual commissioning for an Overhead Hoist Transporter in a semiconductor FAB
  • 2020-11-16
  • International Journal of Production Research, Vol.58, pp.6890-6898
  • Taylor and Francis Ltd.
Optical Vibration Sensor Module Based on Beating Principle for Monitoring of Semiconductor Manufacturing Equipment
  • 2024-09-01
  • International Journal of Precision Engineering and Manufacturing, Vol.25, pp.1917-1924
  • SpringerOpen
Development of Wafer Bonding System for High Precision Bonding Alignment
  • Kim, Tae Ho;
  • Ahn, Dahoon;
  • Lee, Moon G.;
  • Park, Jaehyun;
  • Lee, Hak Jun
  • 2024-09-01
  • International Journal of Precision Engineering and Manufacturing, Vol.25, pp.1823-1841
  • SpringerOpen
Cost-effective and accurate method of measuring fetal fraction using SNP imputationoa mark
  • 2018-04-01
  • Bioinformatics, Vol.34, pp.1086-1091
  • Oxford University Press
A 48×2 CMOS SPAD Sensor With Regulated Dark Count
  • 2024-01-01
  • IEEE Transactions on Circuits and Systems II: Express Briefs, Vol.71, pp.4046-4050
  • Institute of Electrical and Electronics Engineers Inc.
마이크로 기계 가공의 표면 형상 모델링
  • 김종민
  • 2007-02
  • The Graduate School, Ajou University
1 2 3 4 53

Discover