In this study, we developed a rapid three-dimensional (3D) time-of-flight imaging tool for inspection of packaged semiconductor chips, using terahertz (THz) time-domain spectroscopy tech-niques. A high-speed THz system based on the optical sampling by cavity tuning technique is in-corporated with a 2-axis galvano scanner to deliver a scanning speed of more than 100 Hz/pixel with a signal-to-noise ratio larger than 20 dB. Through the use of the Hilbert transformation, we reconstruct the 3D structure of the packaged chip in a nondestructive manner. Additionally, the use of frequency-selective imaging allows us to manipulate image resolution; the higher resolution was obtained when monitored using the higher frequency component. Further, using phase information, we were able to detect and identify defects in the packaged chip, such as the delamination area and epoxy-rich regions.
Funding: This work was supported by the Midcareer Researcher Program (2020R1A2C1005735) through a National Research Foundation grant funded by the Korean Government and by the Human Resources Program in Energy Technology (20184030202220) of the Korea Institute of Energy Technology Evaluation and Planning (KETEP) grant funded by the Korean Government.
