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Frequency doubler utilizing hetero gate dielectric tunnel field-effect transistor
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Publication Year
2024-04-01
Publisher
Institute of Physics
Citation
Physica Scripta, Vol.99
Keyword
frequency multiplierhetero gate dielectrictunnel field-effect transistor
Mesh Keyword
Amount of informationCommunications systemsFrequency multiplierFrequency sourceHetero-gate dielectricsHigh frequency circuitsHigh frequency HFHigh-density integrated circuitsLower frequenciesWireless communications
All Science Classification Codes (ASJC)
Atomic and Molecular Physics, and OpticsMathematical PhysicsCondensed Matter Physics
Abstract
With the rapid advancements in wireless communication and high-density integrated circuits, the demand for high-frequency sources has become paramount for transmitting vast amounts of information. Modern communication systems often utilize low-frequency sources at the transmitting end, converting them into high-frequency carriers through Intermediate Frequency (IF) for transmission to the receiving end. However, challenges arise in stabilizing high-frequency Voltage Controlled Oscillators (VCOs), leading to the necessity of Frequency Multipliers (FMs) in high-frequency circuits. While existing FMs face issues like harmonic distortion due to internal nonlinear devices, this paper proposes a single-device Frequency Doubler (FD) operation using Hetero-Gate Tunnel Field Effect Transistor (HG-TFET) with ambipolar characteristics. HG-TFET integrates high-κ (HK) materials and an HG structure in the gate dielectric, achieving independent control of tunneling distances and synchronous operation of source-to-channel and channel-to-drain tunneling currents (I SC and I CD) to facilitate FD operation. The paper presents the HG-TFET structure, process flow, and simulation models, followed by an exploration of its operating mechanism and characteristics. The FD circuit configuration, operational principles, and conditions for normal operation are detailed, emphasizing the importance of aligning I SC and I CD. The impact of adjusting HK lengths on I SC and I CD is analyzed, demonstrating the ability to independently control these currents through HG-TFET. Simulation results for FD operation under varying HK lengths (1-10 nm) validate the proposed approach. Additionally, the paper investigates the influence of dielectric constant (10-32) and gate dielectric thickness (2-5 nm) on FD performance, highlighting the potential for further optimization. In conclusion, this study establishes a foundation for normal FD operation through the symmetrical control of ambipolar and on currents using HG-TFET. The proposed structure and techniques open avenues for improving the efficiency and reliability of frequency-doubling applications in high-frequency circuits.
Language
eng
URI
https://dspace.ajou.ac.kr/dev/handle/2018.oak/34048
DOI
https://doi.org/10.1088/1402-4896/ad30e3
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Type
Article
Funding
This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea Government (MSIT) under Grant NRF-2022R1A2C1093201. This work was supported by the Technology Innovation Program (20026440, Development of eGaN HEMT Device Advancement Technology using GaN Standard Modeling Technology(ASM))funded By the Ministry of Trade, Industry & Energy (MOTIE, Korea). The EDA tool was supported by the IC Design Education Center (IDEC), KOREA.
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Kim, Jang Hyun Image
Kim, Jang Hyun김장현
Department of Electrical and Computer Engineering
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