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A Comprehensive Review on Hot Deformation Behavior of High-Entropy Alloys for High Temperature Applications
  • Jain, Reliance ;
  • Jain, Sandeep ;
  • Nagarjuna, Cheenepalli ;
  • Samal, Sumanta ;
  • Rananavare, Anuja P. ;
  • Dewangan, Sheetal Kumar ;
  • Ahn, Byungmin
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Publication Year
2025-01-01
Journal
Metals and Materials International
Publisher
Korean Institute of Metals and Materials
Citation
Metals and Materials International
Keyword
High entropy alloysHigh temperature applicationsHot deformation behaviorIntegrated computational materials engineering approachMachine learning
Mesh Keyword
Computational materialsConventional alloysHigh entropy alloysHigh-temperature applicationHot deformation behaviorsHot workabilityIntegrated computational material engineering approachMachine-learningMaterial engineeringProcessing maps
All Science Classification Codes (ASJC)
Condensed Matter PhysicsMechanics of MaterialsMetals and AlloysMaterials Chemistry
Abstract
In contrast to conventional alloys, multicomponent high-entropy alloys (HEAs) have emerged as promising candidates in the field of advanced materials because of their unique composition, microstructure, mechanical and thermal properties, rendering these materials well-suited for a diverse range of applications. For high temperature applications, understanding the hot workability of HEAs is essential for optimizing their processing conditions, tailoring their microstructures and mechanical properties. The current review provides a comprehensive overview of the hot workability of HEAs, including the compression phenomenon observed during hot deformation, the application and use of processing maps, modeling approaches for predicting flow stress, and the deformation mechanisms involved. Different design strategies applicable to HEAs for high-temperature applications have been discussed in this review. The prediction of hot deformation behaviors and processing maps of different HEAs can benefit the research community in designing and developing HEAs for high-temperature applications. Furthermore, we highlight the future scope and challenges in this field.
ISSN
2005-4149
Language
eng
URI
https://aurora.ajou.ac.kr/handle/2018.oak/38513
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85218839512&origin=inward
DOI
https://doi.org/10.1007/s12540-024-01888-2
Journal URL
https://www.springer.com/journal/12540
Type
Article
Funding
This work was supported by a National Research Foundation of Korea (NRF) grant funded by the Korean Government (MSIT) (2021R1A2C1005478). This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (2022R1I1A1A01053047 and 2021R1A6A1A10044950).
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