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Thermal Reduction Method of DC-link Capacitors and SiC MOSFETs in Two-Level Inverters Based on Discontinuous PWM
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Publication Year
2024-01-01
Journal
2024 IEEE Energy Conversion Congress and Exposition, ECCE 2024 - Proceedings
Publisher
Institute of Electrical and Electronics Engineers Inc.
Citation
2024 IEEE Energy Conversion Congress and Exposition, ECCE 2024 - Proceedings, pp.4190-4194
Keyword
DC-link capacitorDiscontinuous PWMReliabilitySiC moduleThermal reduction
Mesh Keyword
Dc-linkDC-link capacitorDiscontinuous PWMInverter-basedPowerlossReduction methodSiC moduleSiC MOSFETsThermal reductionTwo-level inverters
All Science Classification Codes (ASJC)
Energy Engineering and Power TechnologyRenewable Energy, Sustainability and the EnvironmentElectrical and Electronic Engineering
Abstract
This paper proposes a thermal reduction method of DC-link capacitors and SiC MOSFETs in two-level inverters based on discontinuous PWM. The converter reliability has been extensively studied at both the device and the inverter levels through physics of failure analysis. The failures of switch modules and capacitors constitute about 50% of inverter system failures, primarily due to cumulative thermo-mechanical damage from power loss and thermal stress. The power loss and thermal behavior of switching modules are analyzed to reduce the rate of failures in this paper. The proposed method alleviates the thermal stress by applying discontinuous PWM, thereby decreasing power loss. Moreover, a phase-shifted scheme is applied to decrease the ripple current by reducing the loss and temperature of the DC-link capacitor, despite a deterioration in the total harmonic distortion (THD) of the output current. The proposed thermal reduction method is verified by simulation results.
Language
eng
URI
https://aurora.ajou.ac.kr/handle/2018.oak/38158
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=86000453115&origin=inward
DOI
https://doi.org/10.1109/ecce55643.2024.10861797
Journal URL
http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=10860271
Type
Conference Paper
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Lee, Kyo-Beum이교범
Department of Electrical and Computer Engineering
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