Micro IC-LED 진공 라미네이션 공정설계

Abstract

This study focuses on designing a vacuum lamination process to enhance void elimination and structural stability in Micro IC-LED packages. To address issues such as void formation and non-uniform filling often observed in conventional liquid underfill processes, this study utilizes polyimide (PI) substrates and solid-state film-type underfill materials. Instead of employing a traditional design of experiments (DOE) methodology, the experiment is structured using a screening approach informed by prior studies and practical process experience, aiming to investigate the influence of key process parameters. Despite the limited number of experimental conditions, the approach effectively identified the trends in variable influence. <br>This method has been shown to be useful in the early stages of process optimization, particularly in practice-oriented industrial settings.