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Temperature Reduction Method Using Model Predictive Control with Space Vector Modulation in SiC Inverter-Fed Motor Drive Systems
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Publication Year
2024-01-01
Journal
2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion, SPEEDAM 2024
Publisher
Institute of Electrical and Electronics Engineers Inc.
Citation
2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion, SPEEDAM 2024, pp.844-848
Keyword
calculation burdenconduction losscost functionmodel predictive control with space vector modulationswitching loss
Mesh Keyword
Calculation burdenConduction lossCost-functionModel predictive control with space vector modulationModel-predictive controlReduction methodSpace Vector ModulationSwitching lossTemperature reductionVoltage vectors
All Science Classification Codes (ASJC)
Energy Engineering and Power TechnologyElectrical and Electronic EngineeringMechanical EngineeringControl and Optimization
Abstract
This paper proposes a temperature reduction method using model predictive control with space vector modulation in SiC inverter-fed motor drive systems. Conventional approaches to temperature reduction using MPC often face limitations due to the tradeoff between temperature and power quality. The proposed temperature reduction method using MPC with space vector modulation (MPC-SVM) generates virtual voltage vectors to obtain high current quality. Furthermore, the long calculation time to calculate the cost function limits the practical implementation of the scheme. The limitation of calculation time is mitigated by suppressing the calculation of the cost function related to unnecessary voltage vectors. This article achieves effective temperature reduction by minimizing cost functions for current control and reducing loss. Power loss is predicted by constructing an energy-based loss model derived from the dwelling time of voltage vectors. The effectiveness of the proposed method is verified with simulation results.
Language
eng
URI
https://aurora.ajou.ac.kr/handle/2018.oak/37149
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85201735490&origin=inward
DOI
https://doi.org/10.1109/speedam61530.2024.10609174
Journal URL
http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=10609025
Type
Conference
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Lee, Kyo-Beum이교범
Department of Electrical and Computer Engineering
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