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An Efficient, High Power Q-Band SiGe HBT Power Amplifier with A Compact Four-Way Wilkinson Power Combiner Balun for Emerging Very Low-Earth-Orbit SATCOM
  • Lee, Hanjung ;
  • Han, Insu ;
  • Hwang, Jaehyeon ;
  • Ju, Inchan
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Publication Year
2024-01-01
Journal
Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium
Publisher
Institute of Electrical and Electronics Engineers Inc.
Citation
Digest of Papers - IEEE Radio Frequency Integrated Circuits Symposium, pp.291-294
Keyword
BalunBiCMOSHBTLEOpower amplifier (PA)satellite communication (SATCOM)SiGeWilkinson
Mesh Keyword
BalunBiCMOSHigh powerLEOPower amplifierQ-bandsSatellite communicationSatellite communicationsSiGe HBTsWilkinson
All Science Classification Codes (ASJC)
Engineering (all)
Abstract
This work presents an energy-efficient, high power Q-band SiGe HBT cascode power amplifier (PA). A novel four-way Wilkinson power combiner balun (WPCB), realized by two coupled line impedance inverting baluns, is proposed not only to simplify signal routing for compact size, but also to obtain efficient power combining with an excellent signal balance. A prototype Q-band PA attains measured peak Pout, peak PAE, and power gain of 24.0 dBm, 35.3%, and 23.0 dB at 43.0 GHz, respectively, the highest power density among any Q-band Sibased PAs. Its 1 dB Pout bandwidth (BW) ranges from 37.0 to 43.0 GHz, covering downlink of Very Low Earth orbit (VLEO) satellite communication (SATCOM). The PA delivers Pavg of 18.1 dBm with PAEavg of 21.0% at 250MHz symbol rate DVB-S2X 64 APSK modulation.
ISSN
1529-2517
Language
eng
URI
https://aurora.ajou.ac.kr/handle/2018.oak/37144
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85200266701&origin=inward
DOI
https://doi.org/10.1109/rfic61187.2024.10600007
Type
Conference
Funding
This research was supported by National RD Program through the National Research Foundation of Korea (NRF) funded by Ministry of Science and ICT (NRF- 2022M3I8A1078437). The authors are grateful to the GlobalFoundries SiGe team for chip fabrication. They also would like to thank the Integrated circuit Design Education Center (IDEC) for providing EDA tools.
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Ju, Inchan주인찬
Department of Electrical and Computer Engineering
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