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Emerging interconnection technology and pb-free solder materials for advanced microelectronic packagingoa mark

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Publication Year
2021-12-01
Journal
Metals
Publisher
MDPI
Citation
Metals, Vol.11 No.12
All Science Classification Codes (ASJC)
Materials Science (all)Metals and Alloys
ISSN
2075-4701
Language
eng
URI
https://aurora.ajou.ac.kr/handle/2018.oak/32400
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85120032714&origin=inward
DOI
https://doi.org/2-s2.0-85120032714
Journal URL
https://www.mdpi.com/2075-4701/11/12/1941/pdf
Type
Article
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Ahn, Byungmin 안병민
Department of Materials Science Engineering
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