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Showing results 1 to 10 of 1083 (Search time: 0.0 seconds).

Microstructural and Tribological Behavior of Pulse Electroplated Nickel Barrier on Copper Conductors
  • 2019-05-04
  • Tribology Transactions, Vol.62, pp.476-485
  • Taylor and Francis Inc.
Exploring the mechanical and tribological properties of AlCrFeNiTi high-entropy alloy fabricated by mechanical alloying and spark plasma sintering
  • Nagarjuna, Cheenepalli;
  • Dewangan, Sheetal Kumar;
  • Lee, Hansung;
  • Lee, Kwan;
  • Ahn, Byungmin
  • 2023-12-01
  • Vacuum, Vol.218
  • Elsevier Ltd
Dry Sliding Wear Behavior of Sn and NiSn Overlays on Cu Connectors
  • 2018-12-01
  • Tribology Letters, Vol.66
  • Springer New York LLC
Taguchi optimization of tribological properties and corrosion behavior of self-lubricating Al–Mg–Si/MoS2 composite processed by powder metallurgyoa mark
  • 2023-09-01
  • Journal of Materials Research and Technology, Vol.26, pp.1185-1197
  • Elsevier Editora Ltda
Dry sliding wear and friction behavior of powder metallurgy FeCoNiAlSi0.2 high-entropy alloys
  • 2023-10-15
  • Wear, Vol.530-531
  • Elsevier Ltd
Taguchi optimized wear and self-lubricating properties of Al-alloy composite reinforced with hybrid B4C–MoS2 particulatesoa mark
  • 2024-01-01
  • Journal of Materials Research and Technology, Vol.28, pp.4142-4151
  • Elsevier Editora Ltda
Oxidative and abrasive wear of multiphase AlSi0.75TiMnFeCux (X = 0, 0.25, 0.5) high entropy alloy under non-lubricating reciprocating motion
  • 2023-01-01
  • Powder Metallurgy, Vol.66, pp.623-634
  • Taylor and Francis Ltd.
Microstructure, mechanical and tribological properties of oxide dispersion strengthened CoCrFeMnNi high-entropy alloys fabricated by powder metallurgyoa mark
  • Nagarjuna, Cheenepalli;
  • Sharma, Ashutosh;
  • Lee, Kwan;
  • Hong, Soon Jik;
  • Ahn, Byungmin
  • 2023-01-01
  • Journal of Materials Research and Technology, Vol.22, pp.1708-1722
  • Elsevier Editora Ltda
Strengthening of mechanical and tribological properties in CrFeCuMnNi high entropy alloy through dispersion of TiO2 reinforcement via powder metallurgy processes
  • Nagarjuna, Cheenepalli;
  • Dewangan, Sheetal Kumar;
  • Rao, K. Raja;
  • Mohan, Man;
  • Lee, Hansung;
  • Song, Eunhyo;
  • Ahn, Byungmin
  • 2024-12-15
  • Ceramics International, Vol.50, pp.53059-53072
  • Elsevier Ltd
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