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Showing results 1 to 10 of 15696 (Search time: 0.0 seconds).

Investigation of electrochemical corrosion behavior of additive manufactured Ti–6Al–4V alloy for medical implants in different electrolytes
  • Sharma, Ashutosh;
  • Oh, Min Chul;
  • Kim, Jung Taek;
  • Srivastava, Ashok K.;
  • Ahn, Byungmin
  • 2020-07-25
  • Journal of Alloys and Compounds, Vol.830
  • Elsevier Ltd
Vacuum brazing of Al2O3 and 3D printed Ti6Al4V lap-joints using high entropy driven AlZnCuFeSi filleroa mark
  • 2021-12-01
  • Scientific Reports, Vol.11
  • Nature Research
Quantitative analysis of cryomilled nanocrystalline Ti-6Al-4V alloy powder by X-ray diffractionoa mark
  • 2018-01-01
  • Archives of Metallurgy and Materials, Vol.63, pp.1439-1442
  • Polish Academy of Sciences
Phase Transformation and Alloying Behavior of AlCoCrFeNiX (X=Cu, Mg, Mn, Ti, Zn) High Entropy Alloys
  • Oh, Minchul
  • 2018-08
  • The Graduate School, Ajou University
Lightweight AlCuFeMnMgTi High Entropy Alloy with High Strength-to-Density Ratio Processed by Powder Metallurgy
  • 2021-04-01
  • Metals and Materials International, Vol.27, pp.629-638
  • Korean Institute of Metals and Materials
Microstructural tailoring and enhancement in compressive properties of additive manufactured ti-6al-4v alloy through heat treatmentoa mark
  • 2021-10-01
  • Materials, Vol.14
  • MDPI
Phase separation and mechanical behavior of AlCoCrFeNi-X (X = Cu, Mn, Ti) high entropy alloys processed via powder metallurgy
  • 2021-12-01
  • Intermetallics, Vol.139
  • Elsevier Ltd
Microstructure and nanoscratch behavior of spark-plasma-sintered Ti-V-Al-Nb-Hf high-entropy alloyoa mark
  • Dewangan, Sheetal Kumar;
  • Cheenepalli, Nagarjuna;
  • Lee, Hansung;
  • Ahn, Byungmin
  • 2024-07-01
  • Journal of Materials Research and Technology, Vol.31, pp.3781-3789
  • Elsevier Editora Ltda
Microstructural characterization and thermal stability of AlCrFeNiTi + Y2O3 high-entropy alloy nanocomposites prepared by mechanical alloying
  • Raja Rao, K.;
  • Mohan, Man;
  • Dewangan, Sheetal Kumar;
  • Nagarjuna, Cheenepalli;
  • Lee, Kwan;
  • Ahn, Byungmin
  • 2024-10-01
  • Materials Letters, Vol.372
  • Elsevier B.V.
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