Ajou University repository

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Showing results 1 to 10 of 28 (Search time: 0.0 seconds).

Flux 조성 및 solder powder size가 solder paste 특성에 미치는 영향
  • 김동식
  • 2001
  • The Graduate School, Ajou University
Pulse plated Sn-Cu solder coatings from stannate bath
  • 2020-01-17
  • Soldering and Surface Mount Technology, Vol.32, pp.24-32
  • Emerald Group Holdings Ltd.
Sn-Cu-Ni계 Lead Free Solder 합금의 제조 및 특성
  • 박종원
  • 2002
  • The Graduate School, Ajou University
Emerging interconnection technology and pb-free solder materials for advanced microelectronic packagingoa mark
  • 2021-12-01
  • Metals, Vol.11
  • MDPI
Effect of current density and alkaline pH on morphology and properties of electroplated Snoa mark
  • 2019-01-01
  • Materials Research Express, Vol.6
  • Institute of Physics Publishing
Microstructure, mechanical properties, and drop reliability of CeO2 reinforced Sn-9Zn composite for low temperature soldering
  • 2019-01-01
  • Materials Research Express, Vol.6
  • Institute of Physics Publishing
Solderability, microstructure, and thermal characteristics of Sn‐0.7Cu alloy processed by high‐ energy ball millingoa mark
  • 2020-03-01
  • Metals, Vol.10
  • MDPI AG
Impact of Non-Reactive Ceria Nanoparticles on the Wettability and Reaction Kinetics Between Lead-Free Sn–58Bi and Cu Pad
  • 2019-07-01
  • Metals and Materials International, Vol.25, pp.1027-1038
  • Korean Institute of Metals and Materials
Microstructure, Wetting, and Tensile Behaviors of Sn-Ag Alloy Reinforced with Copper-Coated Carbon Nanofibers Produced by the Melting and Casting Route
  • 2019-11-01
  • Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol.50, pp.5384-5394
  • Springer Boston
Pulse co-deposition of tin-silver alloy from citric acid plating bath for microelectronic applications
  • 2019-11-06
  • Materials Research Express, Vol.6
  • Institute of Physics Publishing
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