AURORA: Ajou Univ. Repository: Emerging interconnection technology and pb-free solder materials for advanced microelectronic packaging

Emerging interconnection technology and pb-free solder materials for advanced microelectronic packagingoa mark

Ahn, Byungmin

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Publication Year: 2021-12-01

Publisher: MDPI

Citation: Metals, Vol.11

All Science Classification Codes (ASJC): Materials Science (all)Metals and Alloys

ISSN: 2075-4701

Language: eng

URI: https://dspace.ajou.ac.kr/dev/handle/2018.oak/32400

DOI: https://doi.org/10.3390/met11121941

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Type: Editorial

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Ahn, Byungmin 안병민: Department of Materials Science Engineering

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