Citation Export
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ahn, Byungmin | - |
| dc.date.issued | 2021-12-01 | - |
| dc.identifier.issn | 2075-4701 | - |
| dc.identifier.uri | https://dspace.ajou.ac.kr/dev/handle/2018.oak/32400 | - |
| dc.language.iso | eng | - |
| dc.publisher | MDPI | - |
| dc.title | Emerging interconnection technology and pb-free solder materials for advanced microelectronic packaging | - |
| dc.type | Editorial | - |
| dc.citation.title | Metals | - |
| dc.citation.volume | 11 | - |
| dc.identifier.bibliographicCitation | Metals, Vol.11 | - |
| dc.identifier.doi | 10.3390/met11121941 | - |
| dc.identifier.scopusid | 2-s2.0-85120032714 | - |
| dc.identifier.url | https://www.mdpi.com/2075-4701/11/12/1941/pdf | - |
| dc.description.isoa | true | - |
| dc.subject.subarea | Materials Science (all) | - |
| dc.subject.subarea | Metals and Alloys | - |
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