Ajou University repository

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Showing results 1 to 10 of 125 (Search time: 0.0 seconds).

Emerging interconnection technology and pb-free solder materials for advanced microelectronic packagingoa mark
  • 2021-12-01
  • Metals, Vol.11
  • MDPI
Pulse co-deposition of tin-silver alloy from citric acid plating bath for microelectronic applications
  • 2019-11-06
  • Materials Research Express, Vol.6
  • Institute of Physics Publishing
Template-assisted fabrication of nanostructured tin (β-Sn) arrays for bulk microelectronic packaging devicesoa mark
  • 2018-05-11
  • Metals, Vol.8
  • MDPI AG
도체판이 삽입된 밀리미터파 세라믹 패키지
  • 김진태
  • 2005
  • The Graduate School, Ajou University
패키지 고장 메커니즘 기반의 고출력 백색 LED 가속수명시험
  • 천성일
  • 2011-02
  • The Graduate School, Ajou University
Optical fiber Fabry-Pérot micro-displacement sensor for MEMS in-plane motion stageoa mark
  • 2018-02-05
  • Microelectronic Engineering, Vol.187-188, pp.6-13
  • Elsevier B.V.
Evaluation of Workloads of Package Deliverers Focusing on Their Pickup and Delivery Tasks in Republic of Koreaoa mark
  • 2022-05-01
  • Sustainability (Switzerland), Vol.14
  • MDPI
Development of the Human-Computer Interface Program for the AMBIDEXTER Plant Analyzer Package
  • 윤정선
  • 2001
  • The Graduate School, Ajou University
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