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Showing results 1 to 10 of 2618 (Search time: 0.0 seconds).

Pulse co-deposition of tin-silver alloy from citric acid plating bath for microelectronic applications
  • 2019-11-06
  • Materials Research Express, Vol.6
  • Institute of Physics Publishing
A CMOS 6–10 GHz impulse radio UWB transmitter based on gated oscillator with switching pulse shaper
  • 2018-07-01
  • Microelectronics Journal, Vol.77, pp.1-4
  • Elsevier Ltd
Emerging interconnection technology and pb-free solder materials for advanced microelectronic packagingoa mark
  • 2021-12-01
  • Metals, Vol.11
  • MDPI
Recent advances in brazing fillers for joining of dissimilar materialsoa mark
  • 2021-07-01
  • Metals, Vol.11
  • MDPI AG
Anisotropic Diffusion of Charges on Au Nanoclusters Embedded in Al2O3 Dielectrics
  • Park, Jinhong;
  • Choi, Jinhyeok;
  • Choi, Moonkang;
  • Ryu, Hyunyeol;
  • Ryu, Hanyoul;
  • Lee, Hyungwoo;
  • Lee, Minbaek
  • 2020-03-01
  • Physica Status Solidi - Rapid Research Letters, Vol.14
  • Wiley-VCH Verlag
Self-Aligned Edge Contact Process for Fabricating High-Performance Transition-Metal Dichalcogenide Field-Effect Transistors
  • 2024-09-10
  • ACS Nano, Vol.18, pp.25009-25017
  • American Chemical Society
Dielectric properties of low-temperature sintered forsterite (Mg2SiO4) using high-dispersion and nanoparticle-based solid-state reaction process
  • Asghar, Ghulam;
  • Dong, Xue;
  • Chae, Sudong;
  • Yoo, Chan Sei;
  • Jeon, Jiho;
  • Woo, Chaeheon;
  • Kim, Tae Yeong;
  • Ahn, Jungyoon;
  • Zhang, Xiaojie;
  • Oh, Hyung Suk;
  • Yu, Hak Ki;
  • Choi, Jae Young
  • 2023-04-15
  • Materials Letters, Vol.337
  • Elsevier B.V.
Optical fiber Fabry-Pérot micro-displacement sensor for MEMS in-plane motion stageoa mark
  • 2018-02-05
  • Microelectronic Engineering, Vol.187-188, pp.6-13
  • Elsevier B.V.
Template-assisted fabrication of nanostructured tin (β-Sn) arrays for bulk microelectronic packaging devicesoa mark
  • 2018-05-11
  • Metals, Vol.8
  • MDPI AG
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