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Showing results 1 to 10 of 2052 (Search time: 0.0 seconds).

Current Status and Outlook of Low-Melting-Point Metals in Biomedical Applications
  • 2024-08-01
  • Advanced Functional Materials, Vol.34
  • John Wiley and Sons Inc
Interfacial engineering of ZrO2 metal-insulator-metal capacitor using Al2O3/TiO2 buffer layer for improved leakage propertiesoa mark
  • 2022-01-01
  • Journal of Asian Ceramic Societies, Vol.10, pp.649-659
  • Taylor and Francis Ltd.
Controlled Surface Morphology and Electrical Properties of Sputtered Titanium Nitride Thin Film for Metal–Insulator–Metal Structuresoa mark
  • Dongquoc, Viet;
  • Seo, Dong Bum;
  • Anh, Cao Viet;
  • Lee, Jae Hyun;
  • Park, Jun Hong;
  • Kim, Eui Tae
  • 2022-10-01
  • Applied Sciences (Switzerland), Vol.12
  • MDPI
Study of Metal–Dielectric Interface for Improving Electrical Properties and Reliability of DRAM Capacitor
  • Lim, Han Jin;
  • Choi, Jae Hyoung;
  • Cho, Gihee;
  • Chang, Jaewan;
  • Kim, Younsoo;
  • Jung, Hyung Suk;
  • Shin, Kyoung Sub;
  • Seo, Hyungtak;
  • Jeon, Hyeongtag
  • 2023-10-24
  • Advanced Materials Technologies, Vol.8
  • John Wiley and Sons Inc
Intagliated Cu substrate containing multifunctional lithiophilic trenches for Li metal anodes
  • Park, Sunwoo;
  • Ahn, Kihyeon;
  • Lim, Hyung Kyu;
  • Jin, Hyoung Joon;
  • Han, Seungyong;
  • Yun, Young Soo
  • 2022-01-15
  • Chemical Engineering Journal, Vol.428
  • Elsevier B.V.
Solution-processed metal oxide dielectric films: Progress and outlookoa mark
  • Lee, Won June;
  • Kwak, Taehyun;
  • Choi, Jun Gyu;
  • Park, Sungjun;
  • Yoon, Myung Han
  • 2021-12-01
  • APL Materials, Vol.9
  • American Institute of Physics Inc.
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