Ajou University repository

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Showing results 1 to 10 of 1762 (Search time: 0.0 seconds).

Pulse co-deposition of tin-silver alloy from citric acid plating bath for microelectronic applications
  • 2019-11-06
  • Materials Research Express, Vol.6
  • Institute of Physics Publishing
Microstructure, mechanical properties, and drop reliability of CeO2 reinforced Sn-9Zn composite for low temperature soldering
  • 2019-01-01
  • Materials Research Express, Vol.6
  • Institute of Physics Publishing
Emerging interconnection technology and pb-free solder materials for advanced microelectronic packagingoa mark
  • 2021-12-01
  • Metals, Vol.11
  • MDPI
ZrO 2 Nanoparticle Embedded Low Silver Lead Free Solder Alloy for Modern Electronic Devices
  • 2019-01-18
  • Electronic Materials Letters, Vol.15, pp.27-35
  • The Korean Institute of Metals and Materials
Impact of Non-Reactive Ceria Nanoparticles on the Wettability and Reaction Kinetics Between Lead-Free Sn–58Bi and Cu Pad
  • 2019-07-01
  • Metals and Materials International, Vol.25, pp.1027-1038
  • Korean Institute of Metals and Materials
Effect of current density and alkaline pH on morphology and properties of electroplated Snoa mark
  • 2019-01-01
  • Materials Research Express, Vol.6
  • Institute of Physics Publishing
Morphology, resistivity and corrosion behavior of tin coatings plated from citric acid bath
  • 2019-10-18
  • Materials Research Express, Vol.6
  • Institute of Physics Publishing
A facile method for the production of sn-ag alloy by high energy ball millingoa mark
  • 2020-01-01
  • Archives of Metallurgy and Materials, Vol.65, pp.1329-1333
  • Polska Akademia Nauk
Sn-Cu-Ni계 Lead Free Solder 합금의 제조 및 특성
  • 박종원
  • 2002
  • The Graduate School, Ajou University
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