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Design of a Flexible Thin-Film Encapsulant with Sandwich Structures of Perhydropolysilazane Layers

Kim, Dajeong;
Jeon, Gyeong G.;
Kim, Jong H.;
Kim, Jincheol;
Park, Nochang

2022-08-03
ACS Applied Materials and Interfaces, Vol.14, pp.34678-34685
American Chemical Society

FEP encapsulated crack-based sensor for measurement in moisture-laden environmentoa mark

Kim, Minho;
Choi, Hyesu;
Kim, Taewi;
Hong, Insic;
Roh, Yeonwook;
Park, Jieun;
Seo, Sung Chul;
Han, Seungyong;
Koh, Je sung;
Kang, Daeshik

2019-01-01
Materials, Vol.12
MDPI AG

Polyimide encapsulation of spider-inspired crack-based sensors for durability improvementoa mark

Kim, Taewi;
Lee, Taemin;
Lee, Gunhee;
Choi, Yong Whan;
Kim, Sang Moon;
Kang, Daeshik;
Choi, Mansoo

2018-03-03
Applied Sciences (Switzerland), Vol.8
MDPI AG

Functional Encapsulating Structure for Wireless and Immediate Monitoring of the Fluid Penetration

Lim, Daseul;
Hong, Insic;
Park, Sang Uk;
Chae, Jeong Woo;
Lee, Seunggon;
Baac, Hyoung Won;
Shin, Changhwan;
Lee, Jungheon;
Roh, Yeonwook;
Im, Chaewan;
Park, Yoonseok;
Lee, Geumbee;
Kim, Uikyum;
Koh, Je Sung;
Kang, Daeshik;
Han, Seungyong;
Won, Sang Min

2022-08-01
Advanced Functional Materials, Vol.32
John Wiley and Sons Inc

CdSe/ZnS quantum dot encapsulated MoS2 phototransistor for enhanced radiation hardnessoa mark

Park, Jinwu;
Yoo, Geonwook;
Heo, Junseok

2019-12-01
Scientific Reports, Vol.9
Nature Publishing Group

Ultra-thin thermally grown silicon dioxide nanomembrane for waterproof perovskite solar cells

Cho, Myeongki;
Jeon, Gyeong G.;
Sang, Mingyu;
Kim, Tae Soo;
Suh, Jungmin;
Shin, So Jeong;
Choi, Min Jun;
Kim, Hyun Woo;
Kim, Kyubeen;
Lee, Ju Young;
Noh, Jeong Yeon;
Kim, Jong H.;
Kim, Jincheol;
Park, Nochang;
Yu, Ki Jun

2023-04-15
Journal of Power Sources, Vol.563
Elsevier B.V.

Low-Temperature Direct Growth of Amorphous Boron Nitride Films for High-Performance Nanoelectronic Device Applicationsoa mark

Sattari-Esfahlan, Seyed Mehdi;
Kim, Hyoung Gyun;
Hyun, Sang Hwa;
Choi, Jun Hui;
Hwang, Hyun Sik;
Kim, Eui Tae;
Park, Hyeong Gi;
Lee, Jae Hyun

2023-02-08
ACS Applied Materials and Interfaces, Vol.15, pp.7274-7281
American Chemical Society

Semipermanent Copper Nanowire Network with an Oxidation-Proof Encapsulation Layer

Hong, Insic;
Roh, Yeonwook;
Koh, Je Sung;
Na, Seonyeob;
Kim, Taewi;
Lee, Eunhan;
An, Hyeongi;
Kwon, Jinhyeong;
Yeo, Junyeob;
Hong, Sukjoon;
Lee, Kyu Tae;
Kang, Daeshik;
Ko, Seung Hwan;
Han, Seungyong

2019-04-01
Advanced Materials Technologies, Vol.4
Wiley-Blackwell

A Fully Biodegradable and Ultra-Sensitive Crack-Based Strain Sensor for Biomechanical Signal Monitoringoa mark

Lee, Jae Hwan;
Bae, Jae Young;
Kim, Yoon Nam;
Chae, Minseong;
Lee, Woo Jin;
Lee, Junsang;
Kim, Im Deok;
Hyun, Jung Keun;
Lee, Kang Sik;
Kang, Daeshik;
Kang, Seung Kyun

2024-10-08
Advanced Functional Materials, Vol.34
John Wiley and Sons Inc

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