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to 10 of 3721 (Search time: 0.0 seconds).
Emerging interconnection technology and pb-free solder materials for advanced microelectronic packaging
oa mark
Ahn, Byungmin
2021-12-01
Metals, Vol.11
MDPI
Advancements of hot-melt extrusion technology to address unmet patient needs and pharmaceutical quality aspects
Park, Chulhun;
Renuka, Vanamane S.;
Lee, Beom Jin
;
de la Peña, Ike;
Park, Jun Bom
2024-01-01
Journal of Pharmaceutical Investigation
Springer
Whole-cell biocatalysis: Advancements toward the biosynthesis of fuels
Madavi, Tanushree Baldeo;
Chauhan, Sushma;
Keshri, Anushri;
Alavilli, Hemasundar;
Choi, Kwon Young
;
Pamidimarri, Sudheer D.V.N.
2022-05-01
Biofuels, Bioproducts and Biorefining, Vol.16, pp.859-876
John Wiley and Sons Ltd
Security Requirements and Architecture for Advanced Metering Infrastructure
Lim, Hyunwoo
2015-08
The Graduate School, Ajou University
Toward Advanced High-k and Electrode Thin Films for DRAM Capacitors via Atomic Layer Deposition
Kim, Se Eun;
Sung, Ju Young;
Jeon, Jae Deock;
Jang, Seo Young;
Lee, Hye Min;
Moon, Sang Mo;
Kang, Jun Goo;
Lim, Han Jin;
Jung, Hyung Suk;
Lee, Sang Woon
2023-10-24
Advanced Materials Technologies, Vol.8
John Wiley and Sons Inc
SDN-Based Development Direction of C2 Network System According to Network Technology Development Trend
Lee, Gyu Min;
Choi, Eun Ho;
Cho, Bong Ik;
Roh, Byeong Hee
;
Ryu, Dong Kuk;
Park, Gyudong
2020-04-01
Journal of Korean Institute of Communications and Information Sciences, Vol.45, pp.730-738
Korean Institute of Communications and Information Sciences
A decision-making framework to select a maintenance technology
SURIYAWONG SARAYUT
2018-02
The Graduate School, Ajou University
A deep dive into cybersecurity solutions for AI-driven IoT-enabled smart cities in advanced communication networks
Ali, Jehad
;
Kumar Singh, Sushil;
Jiang, Weiwei;
Alenezi, Abdulmajeed M.;
Islam, Muhammad;
Ibrahim Daradkeh, Yousef;
Mehmood, Asif
2025-01-01
Computer Communications, Vol.229
Elsevier B.V.
Analysis of real-time blockchain considering service level agreement (SLA)
oa mark
Kim, Minkyung
;
Kim, Kangseok
;
Kim, Jai Hoon
2021-01-01
Advances in Science, Technology and Engineering Systems, Vol.6, pp.218-223
ASTES Publishers
Recent advances in brazing fillers for joining of dissimilar materials
oa mark
Ahn, Byungmin
2021-07-01
Metals, Vol.11
MDPI AG
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