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Role of a cyclopentadienyl ligand in a heteroleptic alkoxide precursor in atomic layer deposition
  • Yoon, Hwi ;
  • Lee, Yujin ;
  • Lee, Ga Yeon ;
  • Seo, Seunggi ;
  • Park, Bo Keun ;
  • Chung, Taek Mo ;
  • Oh, Il Kwon ;
  • Kim, Hyungjun
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dc.contributor.authorYoon, Hwi-
dc.contributor.authorLee, Yujin-
dc.contributor.authorLee, Ga Yeon-
dc.contributor.authorSeo, Seunggi-
dc.contributor.authorPark, Bo Keun-
dc.contributor.authorChung, Taek Mo-
dc.contributor.authorOh, Il Kwon-
dc.contributor.authorKim, Hyungjun-
dc.date.issued2024-01-14-
dc.identifier.urihttps://dspace.ajou.ac.kr/dev/handle/2018.oak/33889-
dc.description.abstractAlkoxide precursors have been highlighted for depositing carbon-free films, but their use in Atomic Layer Deposition (ALD) often exhibits a non-saturated growth. This indicates no self-limiting growth due to the chain reaction of hydrolysis or ligand decomposition caused by β-hydride elimination. In the previous study, we demonstrated that self-limiting growth of ALD can be achieved using our newly developed precursor, hafnium cyclopentadienyl tris(N-ethoxy-2,2-dimethyl propanamido) [HfCp(edpa)3]. To elucidate the growth mechanism and the role of cyclopentadienyl (Cp) ligand in a heteroleptic alkoxide precursor, herein, we compare homoleptic and heteroleptic Hf precursors consisting of N-ethoxy-2,2-dimethyl propanamido (edpa) ligands with and without cyclopentadienyl ligand—hafnium tetrakis(N-ethoxy-2,2-dimethyl propanamido) [Hf(edpa)4] and HfCp(edpa)3. We also investigate the role of a Cp ligand in growth characteristics. By substituting an alkoxide ligand with a Cp ligand, we could modify the surface reaction during ALD, preventing undesired reactions. The last remaining edpa after Hf(edpa)4 adsorption can undergo a hydride elimination reaction, resulting in surface O-H generation. In contrast, Cp remains after the HfCp(edpa)3 adsorption. Accordingly, we observe proper ALD growth with self-limiting properties. Thus, a comparative study of different ligands of the precursors can provide critical clues to the design of alkoxide precursors for obtaining typical ALD growth with a saturation behavior.-
dc.description.sponsorshipWe thank Sanghun Lee, Sangyoon Lee, Taewook Nam, Sung Min Park, and Seung Min Chung for the comments on and editing of the manuscript. This work was supported by the Materials and Components Technology Development Program (No. 10080642, development on precursors for carbon/halogen-free thin film and their delivery system for high-k/metal gate application, No. 20012460, Research support group for localization of ALD precursor and parts for 10 nm class semiconductor devices), the Technology Innovation Program [or Industrial Strategic Technology Development Program-Development of material parts package type technology, Core Technology Development on PIM AI semiconductor(R&D)] (No. 20017392, Development of high-performance LMFC for next-generation semiconductor manufacturing, No. 00143986, Equipment Development for SiN deposition with Plasma Source for MTJ Capping Layer), the Technology Innovation Program (High-temperature atomic layer deposition precursors and processes for dielectrics in 3D V-NAND devices, 1415187363) funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea), Development of metal ALD coater for SEM measurement and TEM measurement, 1711198542, Commercialization Promotion Agency for R&D Outcomes(COMPA), the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (Nos. NRF-2022R1A2C2006764, NRF-2021R1A4A1033155, and 2021M3H4A6A01048300), the National Supercomputing Center with supercomputing resources, including technical support (Nos. KSC-2021-CRE-0561, KSC-2021-CRE-0558), and in part, Samsung Display CO., LTD. The manuscript was written through contributions of all authors. All authors have given approval to the final version of the manuscript.-
dc.description.sponsorshipWe thank Sanghun Lee, Sangyoon Lee, Taewook Nam, Sung Min Park, and Seung Min Chung for the comments on and editing of the manuscript. This work was supported by the Materials and Components Technology Development Program (No. 10080642, development on precursors for carbon/halogen-free thin film and their delivery system for high-k/metal gate application, No. 20012460, Research support group for localization of ALD precursor and parts for 10 nm class semiconductor devices), the Technology Innovation Program [or Industrial Strategic Technology Development Program-Development of material parts package type technology, Core Technology Development on PIM AI semiconductor(R&D)] (No. 20017392, Development of high-performance LMFC for next-generation semiconductor manufacturing, No. 00143986, Equipment Development for SiN deposition with Plasma Source for MTJ Capping Layer), the Technology Innovation Program (High-temperature atomic layer deposition precursors and processes for dielectrics in 3D V-NAND devices, 1415187363) funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea), Development of metal ALD coater for SEM measurement and TEM measurement, 1711198542, Commercialization Promotion Agency for R&D Outcomes(COMPA), the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (Nos. NRF-2022R1A2C2006764, NRF-2021R1A4A1033155, and 2021M3H4A6A01048300), the National Supercomputing Center with supercomputing resources, including technical support (Nos. KSC-2021-CRE-0561, KSC-2021-CRE-0558), and in part, Samsung Display CO., LTD. The manuscript was written through contributions of all authors. All authors have given approval to the final version of the manuscript.-
dc.language.isoeng-
dc.publisherAmerican Institute of Physics Inc.-
dc.subject.meshAlkoxide precursor-
dc.subject.meshAtomic-layer deposition-
dc.subject.meshCarbon-free-
dc.subject.meshChain reaction-
dc.subject.meshCyclopentadienyl ligands-
dc.subject.meshCyclopentadienyls-
dc.subject.meshFree films-
dc.subject.meshHeteroleptic-
dc.subject.meshHydride elimination-
dc.subject.meshSelf-limiting growths-
dc.titleRole of a cyclopentadienyl ligand in a heteroleptic alkoxide precursor in atomic layer deposition-
dc.typeArticle-
dc.citation.titleJournal of Chemical Physics-
dc.citation.volume160-
dc.identifier.bibliographicCitationJournal of Chemical Physics, Vol.160-
dc.identifier.doi10.1063/5.0182690-
dc.identifier.pmid38189606-
dc.identifier.scopusid2-s2.0-85181990980-
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/jcp-
dc.description.isoafalse-
dc.subject.subareaPhysics and Astronomy (all)-
dc.subject.subareaPhysical and Theoretical Chemistry-
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