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Browsing by Author : Chae, Heeyeop

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Showing results 1 to 7 of 7

Controlling Bowing and Narrowing in SiO2 Contact-Hole Etch Profiles Using Heptafluoropropyl Methyl Ether as an Etchant with Low Global Warming Potentialoa mark
  • You, Sanghyun;
  • Yang, Hyun Seok;
  • Jeon, Dongjun;
  • Chae, Heeyeop;
  • Kim, Chang Koo
  • 2023-08-01
  • Coatings, Vol.13 No.8
  • Multidisciplinary Digital Publishing Institute (MDPI)
Effect of Discharge Gas Composition on SiC Etching in an HFE-347mmy/O2/Ar Plasmaoa mark
  • 2024-08-01
  • Materials, Vol.17 No.16
  • Multidisciplinary Digital Publishing Institute (MDPI)
Low Global Warming C4H3F7O Isomers for Plasma Etching of SiO2and Si3N4Films
  • Kim, Yongjae;
  • Kim, Seoeun;
  • Kang, Hojin;
  • You, Sanghyun;
  • Kim, Changkoo;
  • Chae, Heeyeop
  • 2022-08-15
  • ACS Sustainable Chemistry and Engineering, Vol.10 No.32, pp.10537-10546
  • American Chemical Society
Plasma atomic layer etching of molybdenum with surface fluorination
  • Kim, Yongjae;
  • Kang, Hojin;
  • Ha, Heeju;
  • Kim, Changkoo;
  • Cho, Sungmin;
  • Chae, Heeyeop
  • 2023-08-01
  • Applied Surface Science, Vol.627
  • Elsevier B.V.
Plasma Atomic Layer Etching of SiO2 and Si3N4 with Low Global Warming C4H3F7O Isomers
  • 2023-04-24
  • ACS Sustainable Chemistry and Engineering, Vol.11 No.16, pp.6136-6142
  • American Chemical Society
Plasma Etching of SiO2 Contact Holes Using Hexafluoroisopropanol and C4F8oa mark
  • 2022-05-01
  • Coatings, Vol.12 No.5
  • MDPI
Quasi atomic layer etching of SiO2 using plasma fluorination for surface cleaning
  • 2018-01-01
  • Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol.36 No.1
  • AVS Science and Technology Society
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