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Detailed examination of the influence of surfactants on the thermal reliability of molten salt microcapsules for high-temperature latent heat storage
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Publication Year
2025-03-15
Journal
Journal of Molecular Liquids
Publisher
Elsevier B.V.
Citation
Journal of Molecular Liquids, Vol.422
Keyword
High-temperature thermal energy storageMicroencapsulationMolten saltSurfactantThermal reliability
Mesh Keyword
Heating and cooling cyclesHigh temperature thermal energy storagesLatent heat storage systemMicrocapsulesMolten saltPolyvinylpyrrolidonesPropertySiO 2ThermalThermal reliability
All Science Classification Codes (ASJC)
Electronic, Optical and Magnetic MaterialsAtomic and Molecular Physics, and OpticsCondensed Matter PhysicsSpectroscopyPhysical and Theoretical ChemistryMaterials Chemistry
Abstract
The thermal reliability of encapsulated phase change materials is important for maintaining the storage density of latent heat storage (LHS) systems under repeated charging and discharging processes. Therefore, this study investigated the influence of polyvinylpyrrolidone (PVP), a surfactant, on the thermal reliability of microencapsulated potassium nitrate (KNO3) in a silica (SiO2) shell in repeated heating and cooling cycles. Different amounts of the surfactant were employed in a sol–gel reaction-based microencapsulation process. The thermal reliability of the microcapsules was examined by comparing their thermal properties, such as the melting peak temperature and melting enthalpy, during 50 repeated heating and cooling cycles using differential scanning calorimetry. In the thermal reliability tests, the thermal properties of the surfactant-aided KNO3 microcapsules drastically changed during the thermal cycle, whereas those of the surfactant-free KNO3 microcapsules remained consistent. Moreover, the melting curves of the surfactant-aided microcapsules exhibited remarkable variations. In addition, the mass loss of the microcapsules for prolonged heating at 400 °C was proportional to the amount of the surfactant used in the encapsulation process, which was attributed to the thermal decomposition of PVP based on thermogravimetric analysis. Using a surfactant deteriorates the thermal reliability of KNO3@SiO2 microcapsules. Furthermore, the superior thermal performance and outstanding thermal reliability of surfactant-free KNO3@SiO2 microcapsules compared to those of surfactant-aided KNO3@SiO2 microcapsules are beneficial for LHS systems.
Language
eng
URI
https://aurora.ajou.ac.kr/handle/2018.oak/38434
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85215429743&origin=inward
DOI
https://doi.org/10.1016/j.molliq.2025.126950
Journal URL
https://www.sciencedirect.com/science/journal/01677322
Type
Article
Funding
This work is supported by National Research Foundation of Korea (NRF) grants funded by the Korea government (MIST) ( NRF-2022R1A2C1005622 and 2009-0082580 ).
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Department of Mechanical Engineering
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