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Reversible Solar Heating and Radiative Cooling Devices via Mechanically Guided Assembly of 3D Macro/Microstructures
  • Lee, Su Eon ;
  • Seo, Junyong ;
  • Kim, Simon ;
  • Park, Jun Hyun ;
  • Jin, Ho Jun ;
  • Ko, Janghun ;
  • Kim, Jang Hwan ;
  • Kang, Heemin ;
  • Kim, Jin Tae ;
  • Lee, Heon ;
  • Lee, Bong Jae ;
  • Kim, Bong Hoon
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Publication Year
2024-09-26
Journal
Advanced Materials
Publisher
John Wiley and Sons Inc
Citation
Advanced Materials, Vol.36 No.39
Keyword
dual-mode thermal managementenergy consumptionmechanical buckling processesradiative coolingsolar thermal absorption
Mesh Keyword
Cooling devicesDual modesDual-mode thermal managementEnergy-consumptionMechanicalMechanical buckling processRadiative coolingSolar thermalSolar thermal absorptionThermal absorptions
All Science Classification Codes (ASJC)
Materials Science (all)Mechanics of MaterialsMechanical Engineering
Abstract
Solar heating and radiative cooling are promising solutions for decreasing global energy consumption because these strategies use the Sun (≈5800 K) as a heating source and outer space (≈3 K) as a cooling source. Although high-performance thermal management can be achieved using these eco-friendly methods, they are limited by daily temperature fluctuations and seasonal changes because of single-mode actuation. Herein, reversible solar heating and radiative cooling devices formed via the mechanically guided assembly of 3D architectures are demonstrated. The fabricated devices exhibit the following properties: i) The devices reversibly change between solar heating and radiative cooling under uniaxial strain, called dual-mode actuation. ii) The 3D platforms in the devices can use rigid/soft materials for functional layers owing to the optimized designs. iii) The devices can be used for dual-mode thermal management on a macro/microscale. The devices use black paint-coated polyimide (PI) films as solar absorbers with multilayered films comprising thin layers of polydimethylsiloxane/silver/PI, achieving heating and cooling temperatures of 59.5 and −11.9 °C, respectively. Moreover, mode changes according to the angle of the 3D structures are demonstrated and the heating/cooling performance with skin, glass, steel, aluminum, copper, and PI substrates is investigated.
ISSN
1521-4095
Language
eng
URI
https://aurora.ajou.ac.kr/handle/2018.oak/38075
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85197921637&origin=inward
DOI
https://doi.org/10.1002/adma.202400930
Journal URL
http://onlinelibrary.wiley.com/journal/10.1002/(ISSN)1521-4095
Type
Article
Funding
S.E.L. and J.S. contributed equally to this work. This study was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No. 2022M3H4A1A02046445, No. RS\u20102024\u201000347619, and No. RS\u20102024\u201000407155).
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Kim, Jang Hwan 김장환
Department of Materials Science Engineering
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