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Cross-linked electrospun cartilage acellular matrix film as an anti-adhesive barrier
  • Kim, Moon Suk ;
  • Park, Joon Yeong ;
  • Park, Seung Hun ;
  • Min, Byoung Hyun
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Publication Year
2019-01-01
Journal
Transactions of the Annual Meeting of the Society for Biomaterials and the Annual International Biomaterials Symposium
Publisher
Society for Biomaterials
Citation
Transactions of the Annual Meeting of the Society for Biomaterials and the Annual International Biomaterials Symposium, Vol.40, p. 438
Mesh Keyword
Acellular matricesAnti-adhesiveCross linking agentsElectrospunsFibrous tissueGlutaraldehydesHealthy tissuesIn-vitro
All Science Classification Codes (ASJC)
BiochemistryBiophysicsBiotechnologyBiomaterialsMaterials Chemistry
Abstract
Statement of Purpose: The cartilage acellular matrix (CAM) has been utilized as a promising biomaterial candidate [1]. Additionally, CAM can inhibit the formation of fibrous tissue and of blood vessels between the injured tissue and the surrounding healthy tissues, indicating that CAM can act as an effective anti-adhesive barrier. CAM powder can easily form a physical film, but a CAM film easily dissolves in media. Therefore, in this work, we prepared a cross-linked CAM (Cx-CAM) film using glutaraldehyde (GA) as a cross-linking agent. Then, we investigated in vitro and in vivo suitability of the Cx-CAM film as the anti-adhesive barrier between an injured tissue and healthy tissues. Because adhesion may cause attachment between an injured tissue and healthy tissues through the formation of blood vessels and/or fibrinous adhesions within 7 days, thus in this work, the antiadhesive effect of Cx-CAM in an injured tissue examined at 7 days.
ISSN
1526-7547
Language
eng
URI
https://aurora.ajou.ac.kr/handle/2018.oak/36498
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85065439171&origin=inward
DOI
https://doi.org/2-s2.0-85065439171
Journal URL
https://www.biomaterials.org/publications/annual-meeting-archives
Type
Conference Paper
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Department of Applied Chemistry & Biological Engineering
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