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Low-profile dipole antenna with parasitic patches
  • Ta, Son Xuat ;
  • Chien, Ngoc Dao ;
  • Kedze, Kam Eucharist ;
  • Park, Ikmo
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dc.contributor.authorTa, Son Xuat-
dc.contributor.authorChien, Ngoc Dao-
dc.contributor.authorKedze, Kam Eucharist-
dc.contributor.authorPark, Ikmo-
dc.date.issued2018-07-25-
dc.identifier.urihttps://aurora.ajou.ac.kr/handle/2018.oak/36262-
dc.identifier.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85051104884&origin=inward-
dc.description.abstractThis paper presents a low-profile broadband antenna, which is composed of four parasitic patches placed between a printed-dipole radiator and a perfect electric conductor ground plane. The radiator and parasitic patches are realized on thin substrates. Owing to the presence of parasitic patches, the antenna performance improves significantly. The antenna design with the overall dimensions of 120 mm × 120 mm × 16.3 mm (0.64λo × 0.64λo × 0.087λo at 1.6 GHz) has a -10 dB impedance bandwidth of 1.465-1.740 GHz, a broadside gain of 8.5-8.8 dBi.-
dc.language.isoeng-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.subject.meshAntenna design-
dc.subject.meshAntenna performance-
dc.subject.meshBroad-band antenna-
dc.subject.meshImpedance bandwidths-
dc.subject.meshLow-profile dipole antennas-
dc.subject.meshParasitic patch-
dc.subject.meshPerfect electric conductor-
dc.subject.meshThin substrate-
dc.titleLow-profile dipole antenna with parasitic patches-
dc.typeConference-
dc.citation.conferenceDate2017.10.16. ~ 2017.10.19.-
dc.citation.conferenceName6th IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2017-
dc.citation.edition2017 IEEE 6th Asia-Pacific Conference on Antennas and Propagation, APCAP 2017 - Proceeding-
dc.citation.endPage3-
dc.citation.startPage1-
dc.citation.title2017 IEEE 6th Asia-Pacific Conference on Antennas and Propagation, APCAP 2017 - Proceeding-
dc.identifier.bibliographicCitation2017 IEEE 6th Asia-Pacific Conference on Antennas and Propagation, APCAP 2017 - Proceeding, pp.1-3-
dc.identifier.doi10.1109/apcap.2017.8420716-
dc.identifier.scopusid2-s2.0-85051104884-
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=8379743-
dc.type.otherConference Paper-
dc.description.isoafalse-
dc.subject.subareaComputer Networks and Communications-
dc.subject.subareaElectrical and Electronic Engineering-
dc.subject.subareaInstrumentation-
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Department of Electrical and Computer Engineering
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