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Showing results 1 to 4 of 4 (Search time: 0.0 seconds).

Effect of integrated copper pad on the performance of boiling-driven wickless thermal ground plane
  • Moon, Joo Hyun;
  • Wang, Xiaomeng;
  • Fadda, Dani;
  • Shin, Dong Hwan;
  • Lee, Jungho;
  • You, Seung M.
  • 2021-11-25
  • Applied Thermal Engineering, Vol.199
  • Elsevier Ltd
Experimental investigation of heat spreading in a wickless and ultrathin thermal ground planeoa mark
  • Wang, Xiaomeng;
  • Moon, Joo Hyun;
  • Fadda, Dani;
  • Shin, Dong Hwan;
  • Lee, Jungho;
  • You, Seung M.
  • 2022-03-01
  • Case Studies in Thermal Engineering, Vol.31
  • Elsevier Ltd
Thermal performance of a boiling-driven heat spreader using passive flow controloa mark
  • Lim, Hyunmuk;
  • Doh, Su Yoon;
  • Shin, Dong Hwan;
  • You, Seung M.;
  • Lee, Jungho
  • 2023-01-01
  • Case Studies in Thermal Engineering, Vol.41
  • Elsevier Ltd
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