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Showing results 1 to 10 of 744 (Search time: 0.0 seconds).

Numerical study on subcooled water jet impingement cooling on superheated surfacesoa mark
  • Moon, Joo Hyun;
  • Lee, Soyeong;
  • Lee, Jungho;
  • Lee, Seong Hyuk
  • 2022-04-01
  • Case Studies in Thermal Engineering, Vol.32
  • Elsevier Ltd
Effects and limitations of superhydrophobic surfaces on the heat transfer performance of a two-phase closed thermosyphon
  • Seo, Donghyun;
  • Park, Jinsoo;
  • Shim, Jaehwan;
  • Nam, Jeonghyeon;
  • Shin, Dong Hwan;
  • Nam, Youngsuk;
  • Lee, Jungho
  • 2021-09-01
  • International Journal of Heat and Mass Transfer, Vol.176
  • Elsevier Ltd
Numerical study of the boiling heat transfer characteristics of bluff body quenching in cylindrical tubeoa mark
  • 2022-04-01
  • Case Studies in Thermal Engineering, Vol.32
  • Elsevier Ltd
Effects of cover plate wettability on pool boiling heat transfer in a narrow gap
  • Rukhsar, Aqsa;
  • Fadda, Dani;
  • Wang, Xiaomeng;
  • Lee, Jungho;
  • You, Seung M.
  • 2024-04-01
  • International Journal of Heat and Mass Transfer, Vol.221
  • Elsevier Ltd
Thermal performance of a boiling-driven heat spreader using passive flow controloa mark
  • Lim, Hyunmuk;
  • Doh, Su Yoon;
  • Shin, Dong Hwan;
  • You, Seung M.;
  • Lee, Jungho
  • 2023-01-01
  • Case Studies in Thermal Engineering, Vol.41
  • Elsevier Ltd
Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review
  • 2021-11-01
  • Journal of Mechanical Science and Technology, Vol.35, pp.4801-4814
  • Korean Society of Mechanical Engineers
Pool boiling heat transfer enhancement using the micro-thick metallic foam surface in saturated water
  • Lim, Hyunmuk;
  • Doh, Su Yoon;
  • Choi, Junyoung;
  • Moc, Jungchan;
  • You, Seung M.;
  • Lee, Jungho
  • 2024-03-01
  • International Communications in Heat and Mass Transfer, Vol.152
  • Elsevier Ltd
Effect of wettability on pool boiling heat transfer with copper microporous coated surface
  • Wang, Xiaomeng;
  • Fadda, Dani;
  • Godinez, Juan;
  • Lee, Jungho;
  • You, Seung M.
  • 2022-09-15
  • International Journal of Heat and Mass Transfer, Vol.194
  • Elsevier Ltd
New thermal packaging with a boiling-driven heat spreader for thermal management of the power electronics
  • 2023-01-25
  • Applied Thermal Engineering, Vol.219
  • Elsevier Ltd
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