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to 10 of 967 (Search time: 0.0 seconds).
Micro-networked metal coating using self-cracked WO3 inorganic thin film as sacrificial layer: Application to transparent flexible electrodes
Kim, Noeul;
Kim, Youngho;
Park, Jung Been;
Cho, Hyeon Ho;
Lee, Dong kyu;
Kwak, Geonho;
Yu, Hak Ki
2021-10-31
Thin Solid Films, Vol.736
Elsevier B.V.
A Fully Biodegradable and Ultra-Sensitive Crack-Based Strain Sensor for Biomechanical Signal Monitoring
oa mark
Lee, Jae Hwan;
Bae, Jae Young;
Kim, Yoon Nam;
Chae, Minseong;
Lee, Woo Jin;
Lee, Junsang;
Kim, Im Deok;
Hyun, Jung Keun;
Lee, Kang Sik;
Kang, Daeshik
;
Kang, Seung Kyun
2024-10-08
Advanced Functional Materials, Vol.34
John Wiley and Sons Inc
Lithographically Defined Zerogap Strain Sensors
oa mark
Moghaddam, Mahsa Haddadi;
Dalayoan, Daryll J.C.;
Park, Daehwan;
Wang, Zhihao;
Kim, Hwanhee;
Im, Sunghoon;
Ji, Kyungbin;
Kang, Daeshik
;
Das, Bamadev;
Kim, Dai Sik
2024-08-21
ACS Photonics, Vol.11, pp.3239-3249
American Chemical Society
FEP encapsulated crack-based sensor for measurement in moisture-laden environment
oa mark
Kim, Minho;
Choi, Hyesu;
Kim, Taewi;
Hong, Insic;
Roh, Yeonwook;
Park, Jieun;
Seo, Sung Chul;
Han, Seungyong
;
Koh, Je sung
;
Kang, Daeshik
2019-01-01
Materials, Vol.12
MDPI AG
Effect of metal thickness on the sensitivity of crack-based sensors
oa mark
Lee, Eunhan;
Kim, Taewi;
Suh, Heeseong;
Kim, Minho;
Pikhitsa, Peter V.;
Han, Seungyong
;
Koh, Je Sung
;
Kang, Daeshik
2018-09-01
Sensors (Switzerland), Vol.18
MDPI AG
Polyimide encapsulation of spider-inspired crack-based sensors for durability improvement
oa mark
Kim, Taewi;
Lee, Taemin;
Lee, Gunhee;
Choi, Yong Whan;
Kim, Sang Moon;
Kang, Daeshik
;
Choi, Mansoo
2018-03-03
Applied Sciences (Switzerland), Vol.8
MDPI AG
Mesoscopic Stacking Reconfigurations in Stacked van der Waals Film
oa mark
Heo, Yoon Seong;
Kim, Tae Wan;
Lee, Wooseok;
Choi, Jungseok;
Park, Soyeon;
Yeom, Dong Il
;
Lee, Jae Ung
2024-05-23
Small, Vol.20
John Wiley and Sons Inc
Crack-assisted charge injection into solvent-free liquid organic semiconductors via local electric field enhancement
oa mark
Kim, Kyoung Hwan;
Park, Myung June
;
Kim, Ju Hyung
2020-08-01
Materials, Vol.13
MDPI AG
Mechanical failures of Two-Dimensional materials on polymer substrates
Chae, Kwanbyung;
Nguyen, Van Tu;
Lee, Sangryun;
Phung, Thi Quynh;
Sim, Yumin;
Seong, Maeng Je;
Lee, Sangwoon
;
Ahn, Yeong Hwan
;
Lee, Soonil
;
Ryu, Seunghwa;
Park, Ji Yong
2022-12-15
Applied Surface Science, Vol.605
Elsevier B.V.
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26
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Graphene
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MoS2
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Photoelectrochemical water splitting
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atomic layer deposition
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Tungsten oxide
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ZnO
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Powder metallurgy
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Applied Surface Science
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Sensors and Actuators, B: Chemical
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Ceramics International
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ACS Applied Materials and Interfaces
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Chemical Communications
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Journal of Alloys and Compounds
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