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to 10 of 1313 (Search time: 0.0 seconds).
Novel surfactant-free microencapsulation of molten salt using TiO2 shell for high temperature thermal energy storage: Thermal performance and thermal reliability
Park, Seunghee;
Jo, Byeongnam
2023-07-01
Journal of Energy Storage, Vol.63
Elsevier Ltd
Noticeable improvement in morphological characteristics and thermal reliability of n-octadecane@SiO2 nanocapsules for thermal energy storage
Kim, Yuhyeok;
Jo, Byeongnam
2022-10-10
International Journal of Energy Research, Vol.46, pp.16854-16869
John Wiley and Sons Ltd
New thermal packaging with a boiling-driven heat spreader for thermal management of the power electronics
Lim, Hyunmuk;
You, Seung M.;
Lee, Jungho
2023-01-25
Applied Thermal Engineering, Vol.219
Elsevier Ltd
Microencapsulated sodium nitrate with titanium-dioxide shell for high-temperature and high-density latent heat storage
Park, Seunghee;
Jo, Byeongnam
2024-08-01
Solar Energy Materials and Solar Cells, Vol.272
Elsevier B.V.
Comparison of washing methods in sol-gel-based nanoencapsulation of paraffins for thermal energy storage: From synthesis to scalability
Kim, Somin;
Gang, Kamchan;
Jo, Byeongnam
2024-12-10
Journal of Energy Storage, Vol.103
Elsevier Ltd
Synthesis and Thermal Performance of Microencapsulated Binary Carbonate Molten Salts for Solar Thermal Energy Storage
Lee, Jaejun;
Jo, Byeongnam
2021-09-02
Energy and Fuels, Vol.35, pp.14130-14139
American Chemical Society
Surfactant-free synthesis protocol of robust and sustainable molten salt microcapsules for solar thermal energy storage
Lee, Jaejun;
Jo, Byeongnam
2021-04-01
Solar Energy Materials and Solar Cells, Vol.222
Elsevier B.V.
Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review
Lim, Hyunmuk;
Lee, Jungho
2021-11-01
Journal of Mechanical Science and Technology, Vol.35, pp.4801-4814
Korean Society of Mechanical Engineers
Development of a hardware simulator for reliable design of modular multilevel converters based on junction-temperature of IGBT modules
oa mark
Jo, Seung Rae;
Kim, Seok Min;
Cho, Sungjoon;
Lee, Kyo Beum
2019-10-01
Electronics (Switzerland), Vol.8
MDPI AG
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Lee, Kyo-Beum
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Lee, Jungho
24
SEO, HYUNGTAK
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Yu, Hak Ki
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thermal damage
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