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Showing results 1 to 10 of 3182 (Search time: 0.0 seconds).

New thermal packaging with a boiling-driven heat spreader for thermal management of the power electronics
  • 2023-01-25
  • Applied Thermal Engineering, Vol.219
  • Elsevier Ltd
Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review
  • 2021-11-01
  • Journal of Mechanical Science and Technology, Vol.35, pp.4801-4814
  • Korean Society of Mechanical Engineers
Comparative study of physics-based modeling and neural network approach to predict cooling in vehicle integrated thermal management systemoa mark
  • Choi, Duwon;
  • An, Youngkuk;
  • Lee, Nankyu;
  • Park, Jinil;
  • Lee, Jonghwa
  • 2020-10-01
  • Energies, Vol.13
  • MDPI AG
An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sink
  • Lee, Haeun;
  • Kang, Minsoo;
  • Jung, Ki Wook;
  • Kharangate, Chirag R.;
  • Lee, Sael;
  • Iyengar, Madhusudan;
  • Malone, Chris;
  • Asheghi, Mehdi;
  • Goodson, Kenneth E.;
  • Lee, Hyoungsoon
  • 2021-07-25
  • Applied Thermal Engineering, Vol.194
  • Elsevier Ltd
Thermal performance of a boiling-driven heat spreader using passive flow controloa mark
  • Lim, Hyunmuk;
  • Doh, Su Yoon;
  • Shin, Dong Hwan;
  • You, Seung M.;
  • Lee, Jungho
  • 2023-01-01
  • Case Studies in Thermal Engineering, Vol.41
  • Elsevier Ltd
Advances in battery thermal management for electric vehicles: A comprehensive review of hybrid PCM-metal foam and immersion cooling technologies
  • Suresh, C.;
  • Awasthi, Abhishek;
  • Kumar, Binit;
  • Im, Seong kyun;
  • Jeon, Yongseok
  • 2025-02-01
  • Renewable and Sustainable Energy Reviews, Vol.208
  • Elsevier Ltd
First Demonstration of Thermally Stable Zr:HfO2Ferroelectrics via Inserting AlN Interlayer
  • Lee, Sangmok;
  • Kim, Giuk;
  • Lee, Sangho;
  • Shin, Hunbeom;
  • Lim, Youngjin;
  • Kim, Kang;
  • Kim, Do Hyung;
  • Oh, Il Kwon;
  • Ko Park, Sang Hee;
  • Ahn, Jinho;
  • Jeon, Sanghun
  • 2024-01-01
  • IEEE Electron Device Letters, Vol.45, pp.1578-1581
  • Institute of Electrical and Electronics Engineers Inc.
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