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to 10 of 2286 (Search time: 0.0 seconds).
Effect of Si alloying on the structural, thermal expansion, and magnetic properties of FeCoNiAlSix high-entropy alloys
Nagarjuna, Cheenepalli;
Dewangan, Sheetal Kumar;
Lee, Hansung;
Madavali, Babu;
Ahn, Byungmin
2024-03-01
Journal of Materials Science, Vol.59, pp.4281-4292
Springer
Surfactant-free synthesis protocol of robust and sustainable molten salt microcapsules for solar thermal energy storage
Lee, Jaejun;
Jo, Byeongnam
2021-04-01
Solar Energy Materials and Solar Cells, Vol.222
Elsevier B.V.
금속 산화물 나노입자의 이성분계 합성과 리튬이온 이차전지에서의 응용
배형봉
2012-02
The Graduate School, Ajou University
Experimental study on the influence of surface roughness for photothermal imaging with various measurement conditions
Kim, Moojoong;
Kim, Gwantaek;
Yoo, Jaisuk;
Kim, Dong Kwon
;
Kim, Hyunjung
2018-03-10
Thermochimica Acta, Vol.661, pp.7-17
Elsevier B.V.
Collinear deflection method for the measurement of thermal conductivity of transparent single layer anisotropic material
oa mark
Kim, Moojoong;
Park, Kuentae;
Kim, Gwantaek;
Yoo, Jaisuk;
Kim, Dong Kwon
;
Kim, Hyunjung
2019-04-01
Applied Sciences (Switzerland), Vol.9
MDPI AG
Junction Temperature Estimation of Direct-Drive GaN HEMTs in Two-Level Inverters for Driving PMSM Through Power Loss Analysis
Lee, In Ho;
Park, Seong Mi;
Cho, Young Hoon;
Lee, Kyo Beum
2024-05-01
Journal of Electrical Engineering and Technology, Vol.19, pp.2205-2216
Korean Institute of Electrical Engineers
First-principles investigation on electronic and thermoelectric properties of chalcogenide compounds and the effect of rare earth and oxygen substitutions
Tran Van Quang
2014-06
The Graduate School, Ajou University
Current Status and Outlook of Low-Melting-Point Metals in Biomedical Applications
Mao, Jianbin;
Kim, Ju Hyung
;
Seo, Soonmin
2024-08-01
Advanced Functional Materials, Vol.34
John Wiley and Sons Inc
Feasibility of novel rear-side mirage deflection method for thermal conductivity measurements
oa mark
Kim, Gwantaek;
Kim, Moojoong;
Kim, Hyunjung
2021-09-01
Sensors, Vol.21
MDPI
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