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to 10 of 4573 (Search time: 0.156 seconds).
A Novel Intrinsic Force Sensing Method for Robot Manipulators during Human-Robot Interaction
oa mark
Kim, Uikyum
;
Jo, Gwanghyun;
Jeong, Heeyeon;
Park, Cheol Hoon;
Koh, Je Sung
;
Park, Dong Il;
Do, Hyunmin;
Choi, Taeyong;
Kim, Hwi Su;
Park, Chanhun
2021-12-01
IEEE Transactions on Robotics, Vol.37, pp.2218-2225
Institute of Electrical and Electronics Engineers Inc.
Arbitrary Surface Contact Sensing Method for Physical Human-Robot Interaction
Jung, Dawoon;
Bu, Seongun;
Kim, Uikyum
2024-06-01
IEEE Transactions on Industrial Informatics, Vol.20, pp.8274-8283
IEEE Computer Society
Intuitive Six-Degree-of-Freedom Human Interface Device for Human-Robot Interaction
Lee, Doohoe;
Hwang, Jinhak;
Jung, Dawoon;
Koh, Je Sung
;
Do, Hyunmin;
Kim, Uikyum
2024-01-01
IEEE Transactions on Instrumentation and Measurement, Vol.73
Institute of Electrical and Electronics Engineers Inc.
Evaluation of Gait-Assistive Soft Wearable Robot Designs for Wear Comfort, Focusing on Electroencephalogram and Satisfaction
Yoon, Jeong Eun;
Chung, Jiwon;
Park, Soah;
Won, Hyunbin;
Kim, Changhwan;
Baek, Inryeol;
Koh, Je Sung
;
Koo, Sumin Helen
2024-01-01
IEEE Robotics and Automation Letters, Vol.9, pp.8834-8841
Institute of Electrical and Electronics Engineers Inc.
Tactile Sensor Integrated Fingertip Capable of Detecting Precise Contact Force for Robotic Grippers
Park, Jeonghwa;
Jung, Dawoon;
Lee, Yooseong;
Park, Dongil;
Choi, Jungil
;
Kim, Uikyum
2024-01-01
IEEE Transactions on Industrial Electronics
Institute of Electrical and Electronics Engineers Inc.
Design of a sensitive balloon sensor for safe human–robot interaction
oa mark
Kim, Dongjin;
Han, Seungyong
;
Kim, Taewi;
Kim, Changhwan;
Lee, Doohoe;
Kang, Daeshik
;
Koh, Je Sung
2021-03-02
Sensors, Vol.21, pp.1-12
MDPI AG
Development of a Three-Axis Monolithic Flexure-Based Ground Reaction Force Sensor for Various Gait Analysis
Jang, Seung Yeon;
Youn, Jung Hwan;
Lim, Su Hyun;
Kim, Seong Su;
Kim, Uikyum
;
Kyung, Ki Uk
2022-04-01
IEEE Robotics and Automation Letters, Vol.7, pp.4118-4125
Institute of Electrical and Electronics Engineers Inc.
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