Ajou University repository

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Showing results 1 to 10 of 1959 (Search time: 0.0 seconds).

Investigation of Analog Memristor Characteristics for Hardware Synaptic Weight in Multilayer Neural Networkoa mark
  • 2024-01-01
  • Advanced Intelligent Systems
  • John Wiley and Sons Inc
Activation-based cause analysis method for neural networksoa mark
  • 2021-01-01
  • IEEE Access, Vol.9, pp.111544-111551
  • Institute of Electrical and Electronics Engineers Inc.
Deep Edu: A Deep Neural Collaborative Filtering for Educational Services Recommendationoa mark
  • Ullah, Farhan;
  • Zhang, Bofeng;
  • Khan, Rehan Ullah;
  • Chung, Tae Sun;
  • Attique, Muhammad;
  • Khan, Khalil;
  • Khediri, Salim El;
  • Jan, Sadeeq
  • 2020-01-01
  • IEEE Access, Vol.8, pp.110915-110928
  • Institute of Electrical and Electronics Engineers Inc.
A neural network model for free-falling condensation heat transfer in the presence of non-condensable gases
  • Cho, Eunho;
  • Lee, Haeun;
  • Kang, Minsoo;
  • Jung, Daewoong;
  • Lee, Geonhee;
  • Lee, Sael;
  • Kharangate, Chirag R.;
  • Ha, Huiun;
  • Huh, Sun;
  • Lee, Hyoungsoon
  • 2022-01-01
  • International Journal of Thermal Sciences, Vol.171
  • Elsevier Masson s.r.l.
Exploration of CNN-based and RNN-based neural networks for Text Classification
  • SUN JING
  • 2018-08
  • The Graduate School, Ajou University
Empirical study of an artificial neural network for a manufacturing production operation
  • 2023-03-01
  • Operations Management Research, Vol.16, pp.311-323
  • Springer
EEG-based emotion classification for Alzheimer’s disease patients using conventional machine learning and recurrent neural network modelsoa mark
  • 2020-12-02
  • Sensors (Switzerland), Vol.20, pp.1-27
  • MDPI AG
An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sink
  • Lee, Haeun;
  • Kang, Minsoo;
  • Jung, Ki Wook;
  • Kharangate, Chirag R.;
  • Lee, Sael;
  • Iyengar, Madhusudan;
  • Malone, Chris;
  • Asheghi, Mehdi;
  • Goodson, Kenneth E.;
  • Lee, Hyoungsoon
  • 2021-07-25
  • Applied Thermal Engineering, Vol.194
  • Elsevier Ltd
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