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Showing results 1 to 10 of 2162 (Search time: 0.0 seconds).

Design of a Flexible Thin-Film Encapsulant with Sandwich Structures of Perhydropolysilazane Layers
  • Kim, Dajeong;
  • Jeon, Gyeong G.;
  • Kim, Jong H.;
  • Kim, Jincheol;
  • Park, Nochang
  • 2022-08-03
  • ACS Applied Materials and Interfaces, Vol.14, pp.34678-34685
  • American Chemical Society
FEP encapsulated crack-based sensor for measurement in moisture-laden environmentoa mark
  • 2019-01-01
  • Materials, Vol.12
  • MDPI AG
Functional Encapsulating Structure for Wireless and Immediate Monitoring of the Fluid Penetration
  • 2022-08-01
  • Advanced Functional Materials, Vol.32
  • John Wiley and Sons Inc
Polyimide encapsulation of spider-inspired crack-based sensors for durability improvementoa mark
  • Kim, Taewi;
  • Lee, Taemin;
  • Lee, Gunhee;
  • Choi, Yong Whan;
  • Kim, Sang Moon;
  • Kang, Daeshik;
  • Choi, Mansoo
  • 2018-03-03
  • Applied Sciences (Switzerland), Vol.8
  • MDPI AG
Ultra-thin thermally grown silicon dioxide nanomembrane for waterproof perovskite solar cells
  • Cho, Myeongki;
  • Jeon, Gyeong G.;
  • Sang, Mingyu;
  • Kim, Tae Soo;
  • Suh, Jungmin;
  • Shin, So Jeong;
  • Choi, Min Jun;
  • Kim, Hyun Woo;
  • Kim, Kyubeen;
  • Lee, Ju Young;
  • Noh, Jeong Yeon;
  • Kim, Jong H.;
  • Kim, Jincheol;
  • Park, Nochang;
  • Yu, Ki Jun
  • 2023-04-15
  • Journal of Power Sources, Vol.563
  • Elsevier B.V.
Microstructural, surface morphological, and magnetic properties of oblique angle deposited Co thin films on ion-beam fabricated self-organized Si substrates
  • Patel, Shiv P.;
  • Basu, T.;
  • Kumar, M.;
  • Mishra, P.;
  • Som, T.
  • 2022-02-01
  • Materials Letters, Vol.308
  • Elsevier B.V.
A Fully Biodegradable and Ultra-Sensitive Crack-Based Strain Sensor for Biomechanical Signal Monitoringoa mark
  • Lee, Jae Hwan;
  • Bae, Jae Young;
  • Kim, Yoon Nam;
  • Chae, Minseong;
  • Lee, Woo Jin;
  • Lee, Junsang;
  • Kim, Im Deok;
  • Hyun, Jung Keun;
  • Lee, Kang Sik;
  • Kang, Daeshik;
  • Kang, Seung Kyun
  • 2024-10-08
  • Advanced Functional Materials, Vol.34
  • John Wiley and Sons Inc
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