Ajou University repository

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Showing results 1 to 10 of 2401 (Search time: 0.0 seconds).

Safety Assessment of Cooperative Platooning in Mixed Traffic †oa mark
  • Park, B. Brian;
  • Lee, Hyejin;
  • Yun, Ilsoo;
  • Park, Jeehyung
  • 2023-01-01
  • Engineering Proceedings, Vol.36
  • Multidisciplinary Digital Publishing Institute (MDPI)
Assessment of two-parameter mixed models for large eddy simulations of transitional and turbulent flows
  • Lee, Young Mo;
  • Hwang, Hyeon Gyu;
  • Lee, Jae Hwa;
  • Lee, Jungil;
  • Park, Jae Sung
  • 2020-02-01
  • Journal of Mechanical Science and Technology, Vol.34, pp.727-743
  • Korean Society of Mechanical Engineers
High-Current-Density Organic Electrochemical Diodes Enabled by Asymmetric Active Layer Designoa mark
  • Kim, Youngseok;
  • Kim, Gunwoo;
  • Ding, Bowen;
  • Jeong, Dahyun;
  • Lee, Inho;
  • Park, Sungjun;
  • Kim, Bumjoon J.;
  • McCulloch, Iain;
  • Heeney, Martin;
  • Yoon, Myung Han
  • 2022-02-01
  • Advanced Materials, Vol.34
  • John Wiley and Sons Inc
Change of limb alignment in Korean children and adolescents with idiopathic genu valgumoa mark
  • Moon, Seo Ho;
  • Kwon, Soon Sun;
  • Park, Moon Seok;
  • Kim, Nak Tscheol;
  • Sung, Ki Hyuk
  • 2021-11-12
  • Medicine (United States), Vol.100
  • Lippincott Williams and Wilkins
Linear mixed modeling on the effects of varus knee surgery on the ankle joint weight-bearing axis
  • 2022-01-01
  • Foot and Ankle Surgery, Vol.28, pp.114-118
  • Elsevier Ltd
Ultraflexible Vertical Corbino Organic Electrochemical Transistors for Epidermal Signal Monitoringoa mark
  • Lee, Inho;
  • Kim, Ji Hwan;
  • Kim, Youngseok;
  • Shin, Dongjoon;
  • Lee, Hyeongbeom;
  • Won, Jonghyun;
  • Kang, Keehoon;
  • Choi, Jun Gyu;
  • Yoon, Myung Han;
  • Park, Sungjun
  • 2025-01-29
  • Advanced Materials, Vol.37
  • John Wiley and Sons Inc
초음파 압전 분사 노즐의 시스템 설계 및 응용
  • 고재석
  • 2005
  • The Graduate School, Ajou University
Novel architecture of onem2m-based convergence platform for mixed reality and iotoa mark
  • 2022-01-01
  • Computers, Materials and Continua, Vol.71, pp.51-69
  • Tech Science Press
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