Ajou University repository

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Showing results 1 to 10 of 381 (Search time: 0.0 seconds).

Logarithmic strain model for nonlinear load celloa mark
  • 2019-08-02
  • Sensors (Switzerland), Vol.19
  • MDPI AG
브라우니안 운동과 분수 브라우니안 운동 표본 경로의 정칙성에 관하여
  • 박지현
  • 2012-02
  • The Graduate School, Ajou University
Role of rat medial prefrontal cortex in time interval estimation
  • Kim, Ji Eun
  • 2013-02
  • The Graduate School, Ajou University
Lithographically Defined Zerogap Strain Sensorsoa mark
  • Moghaddam, Mahsa Haddadi;
  • Dalayoan, Daryll J.C.;
  • Park, Daehwan;
  • Wang, Zhihao;
  • Kim, Hwanhee;
  • Im, Sunghoon;
  • Ji, Kyungbin;
  • Kang, Daeshik;
  • Das, Bamadev;
  • Kim, Dai Sik
  • 2024-08-21
  • ACS Photonics, Vol.11, pp.3239-3249
  • American Chemical Society
A Fully Biodegradable and Ultra-Sensitive Crack-Based Strain Sensor for Biomechanical Signal Monitoringoa mark
  • Lee, Jae Hwan;
  • Bae, Jae Young;
  • Kim, Yoon Nam;
  • Chae, Minseong;
  • Lee, Woo Jin;
  • Lee, Junsang;
  • Kim, Im Deok;
  • Hyun, Jung Keun;
  • Lee, Kang Sik;
  • Kang, Daeshik;
  • Kang, Seung Kyun
  • 2024-10-08
  • Advanced Functional Materials, Vol.34
  • John Wiley and Sons Inc
긴거리 상관된 시간 의존 무작위 퍼텐셜에서 긴거리 상호작용하는 보존들의 양자 임계 현상
  • 조영권
  • 2006-02
  • The Graduate School, Ajou University
Quantitative analysis of cryomilled nanocrystalline Ti-6Al-4V alloy powder by X-ray diffractionoa mark
  • 2018-01-01
  • Archives of Metallurgy and Materials, Vol.63, pp.1439-1442
  • Polish Academy of Sciences
SENSING MECHANISM AND APPLICATION OF MECHANICAL STRAIN SENSOR: A MINI-REVIEWoa mark
  • Ha, Heebo;
  • Qaiser, Nadeem;
  • Yun, Tae Gwang;
  • Cheong, Jun Young;
  • Lim, Sooman;
  • Hwang, Byungil
  • 2023-01-01
  • Facta Universitatis, Series: Mechanical Engineering, Vol.21, pp.751-772
  • University of Nis
Quantum Multi-Agent Reinforcement Learning for Autonomous Mobility Cooperationoa mark
  • Park, Soohyun;
  • Kim, Jae Pyoung;
  • Park, Chanyoung;
  • Jung, Soyi;
  • Kim, Joongheon
  • 2024-06-01
  • IEEE Communications Magazine, Vol.62, pp.106-112
  • Institute of Electrical and Electronics Engineers Inc.
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