Ajou University repository

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Showing results 1 to 10 of 307 (Search time: 0.0 seconds).

Development of a miniaturized PZT-based MEMS Fabry-Perot interferometer with eutectic wafer bonding and its interface electronics
  • Tusher, Md Munirul Islam;
  • Lee, Hyunho;
  • Lee, Sanghoon;
  • Lee, Keekeun
  • 2024-02-01
  • Sensors and Actuators A: Physical, Vol.366
  • Elsevier B.V.
Development of PZT-based MEMS FabryPerot Interferometer with eutectic bonding and its interface electronics
  • TUSHER MD MUNIRUL ISLAM
  • 2023-08
  • The Graduate School, Ajou University
Brazeability, microstructure, and joint characteristics of zro2/ti-6al-4v brazed by ag-cu-ti filler reinforced with cerium oxide nanoparticlesoa mark
  • 2019-01-01
  • Advances in Materials Science and Engineering, Vol.2019
  • Hindawi Limited
Initial relocation behavior of control rod materials in boiling water reactors studied via time-resolved visualization
  • Ueda, Shota;
  • Jo, Byeongnam;
  • Kondo, Masahiro;
  • Erkan, Nejdet;
  • Yajima, Takeshi;
  • Okamoto, Koji
  • 2018-07-01
  • Nuclear Engineering and Design, Vol.333, pp.99-114
  • Elsevier Ltd
전이금속 칼코겐 화합물의 합성과 구조해석 및 특징
  • 김경희
  • 2011-02
  • The Graduate School, Ajou University
새로운 오성분계 황화물의 합성과 특징
  • 이은실
  • 2012-02
  • The Graduate School, Ajou University
Synthesis and Thermal Performance of Microencapsulated Binary Carbonate Molten Salts for Solar Thermal Energy Storage
  • 2021-09-02
  • Energy and Fuels, Vol.35, pp.14130-14139
  • American Chemical Society
Development of Wafer Bonding System for High Precision Bonding Alignment
  • Kim, Tae Ho;
  • Ahn, Dahoon;
  • Lee, Moon G.;
  • Park, Jaehyun;
  • Lee, Hak Jun
  • 2024-09-01
  • International Journal of Precision Engineering and Manufacturing, Vol.25, pp.1823-1841
  • SpringerOpen
Pulse plated Sn-Cu solder coatings from stannate bath
  • 2020-01-17
  • Soldering and Surface Mount Technology, Vol.32, pp.24-32
  • Emerald Group Holdings Ltd.
De facto seniority in the primary market for corporate bonds
  • 2024-04-01
  • Finance Research Letters, Vol.62
  • Elsevier Ltd
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