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메가소닉 교반에 의한 습식 식각 시스템 특성 개선
  • Park, Tae Gyu
  • 2008-08
  • The Graduate School, Ajou University
Etching of Si-based materials using fluorocarbon plasmas : Etch characteristics and its applications
  • 김준현
  • 2019-02
  • The Graduate School, Ajou University
Heptafluoroisopropyl Methyl Ether as a Low Global Warming Potential Alternative for Plasma Etching of SiCoa mark
  • 2024-05-01
  • Korean Journal of Chemical Engineering, Vol.41, pp.1307-1310
  • Springer
Plasma Etching of SiO2 Contact Holes Using Hexafluoroisopropanol and C4F8oa mark
  • 2022-05-01
  • Coatings, Vol.12
  • MDPI
Plasma etching of SiO2 using heptafluoropropyl methyl ether and perfluoropropyl vinyl ether
  • 2018-01-01
  • ECS Journal of Solid State Science and Technology, Vol.7, pp.Q218-Q221
  • Electrochemical Society Inc.
Si3N4 etch rates at various ion-incidence angles in high-density CF4, CHF3, and C2F6 plasmas
  • 2020-02-01
  • Korean Journal of Chemical Engineering, Vol.37, pp.374-379
  • Springer
Heptafluoropropyl methyl ether를 이용한 SiO₂ 콘택홀 플라즈마 순환 식각
  • 이유종
  • 2023-02
  • The Graduate School, Ajou University
Fabrication of High-quality Periodic Ge Nanostructures via Water-based MAC Etching and Their Application for Photovoltaics
  • 윤여준
  • 2022-02
  • The Graduate School, Ajou University
Angular dependence of SiO2 etching in plasmas containing heptafluoropropyl methyl ether
  • 2019-01-01
  • Thin Solid Films, Vol.669, pp.262-268
  • Elsevier B.V.
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