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Showing results 1 to 10 of 3425 (Search time: 0.0 seconds).

Development of Wafer Bonding System for High Precision Bonding Alignment
  • Kim, Tae Ho;
  • Ahn, Dahoon;
  • Lee, Moon G.;
  • Park, Jaehyun;
  • Lee, Hak Jun
  • 2024-09-01
  • International Journal of Precision Engineering and Manufacturing, Vol.25, pp.1823-1841
  • SpringerOpen
Sintering behavior and dielectric properties of A3(PO4)2 compounds (A = Ca, Sr, Ba, Mg, Zn, Ni, Cu)
  • 2022-09-01
  • Materials Science in Semiconductor Processing, Vol.148
  • Elsevier Ltd
Dual thermal stabilizing effects of xanthan gums via glycosylation and hydrogen bonding and in vivo human bioavailability of desmopressin in orodispersible film
  • Gil, Myung Chul;
  • Park, Su Jun;
  • Lee, Bong Sang;
  • Park, Chulhun;
  • Lee, Beom Jin
  • 2023-04-25
  • International Journal of Pharmaceutics, Vol.637
  • Elsevier B.V.
Development of a miniaturized PZT-based MEMS Fabry-Perot interferometer with eutectic wafer bonding and its interface electronics
  • Tusher, Md Munirul Islam;
  • Lee, Hyunho;
  • Lee, Sanghoon;
  • Lee, Keekeun
  • 2024-02-01
  • Sensors and Actuators A: Physical, Vol.366
  • Elsevier B.V.
De facto seniority in the primary market for corporate bonds
  • 2024-04-01
  • Finance Research Letters, Vol.62
  • Elsevier Ltd
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