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to 10 of 197 (Search time: 0.0 seconds).
Lithographically Defined Zerogap Strain Sensors
oa mark
Moghaddam, Mahsa Haddadi;
Dalayoan, Daryll J.C.;
Park, Daehwan;
Wang, Zhihao;
Kim, Hwanhee;
Im, Sunghoon;
Ji, Kyungbin;
Kang, Daeshik
;
Das, Bamadev;
Kim, Dai Sik
2024-08-21
ACS Photonics, Vol.11, pp.3239-3249
American Chemical Society
압력수로터널 주변지반 절리내 수압분포
이일령
2008-02
The Graduate School, Ajou University
A Fully Biodegradable and Ultra-Sensitive Crack-Based Strain Sensor for Biomechanical Signal Monitoring
oa mark
Lee, Jae Hwan;
Bae, Jae Young;
Kim, Yoon Nam;
Chae, Minseong;
Lee, Woo Jin;
Lee, Junsang;
Kim, Im Deok;
Hyun, Jung Keun;
Lee, Kang Sik;
Kang, Daeshik
;
Kang, Seung Kyun
2024-10-08
Advanced Functional Materials, Vol.34
John Wiley and Sons Inc
Effect of metal thickness on the sensitivity of crack-based sensors
oa mark
Lee, Eunhan;
Kim, Taewi;
Suh, Heeseong;
Kim, Minho;
Pikhitsa, Peter V.;
Han, Seungyong
;
Koh, Je Sung
;
Kang, Daeshik
2018-09-01
Sensors (Switzerland), Vol.18
MDPI AG
Foot Plantar Pressure Measurement System Using Highly Sensitive Crack-based Sensor
박지은
2021-02
The Graduate School, Ajou University
Micro-networked metal coating using self-cracked WO3 inorganic thin film as sacrificial layer: Application to transparent flexible electrodes
Kim, Noeul;
Kim, Youngho;
Park, Jung Been;
Cho, Hyeon Ho;
Lee, Dong kyu;
Kwak, Geonho;
Yu, Hak Ki
2021-10-31
Thin Solid Films, Vol.736
Elsevier B.V.
Crack-assisted charge injection into solvent-free liquid organic semiconductors via local electric field enhancement
oa mark
Kim, Kyoung Hwan;
Park, Myung June
;
Kim, Ju Hyung
2020-08-01
Materials, Vol.13
MDPI AG
Ultra-stable and tough bioinspired crack-based tactile sensor for small legged robots
oa mark
Kim, Taewi;
Hong, Insic;
Kim, Minho;
Im, Sunghoon;
Roh, Yeonwook;
Kim, Chang Hwan;
Lim, Jongcheon;
Kim, Dongjin;
Park, Jieun;
Lee, Seunggon;
Lim, Daseul;
Cho, Junggwang;
Huh, Seokhaeng;
Jo, Seung Un;
Kim, Chang Hwan;
Koh, Je Sung
;
Han, Seungyong
;
Kang, Daeshik
2023-12-01
npj Flexible Electronics, Vol.7
Nature Research
FEP encapsulated crack-based sensor for measurement in moisture-laden environment
oa mark
Kim, Minho;
Choi, Hyesu;
Kim, Taewi;
Hong, Insic;
Roh, Yeonwook;
Park, Jieun;
Seo, Sung Chul;
Han, Seungyong
;
Koh, Je sung
;
Kang, Daeshik
2019-01-01
Materials, Vol.12
MDPI AG
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