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Novel egg-carton-shaped paraffin microsheet for high-density latent heat storage
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Publication Year
2024-07-01
Publisher
Elsevier B.V.
Citation
Solar Energy Materials and Solar Cells, Vol.271
Keyword
Dip-coatingLangmuir–blodgett techniqueLatent heat storageMicrosheetPhase change material
Mesh Keyword
Dip coatingIntermittencyLangmuir Blodgett techniquesLatent heat storageMicrosheetPoly(methyl methacrylate)Poly-methyl methacrylatesRenewable energy sourceThermal energy storageThermal energy storage systems
All Science Classification Codes (ASJC)
Electronic, Optical and Magnetic MaterialsRenewable Energy, Sustainability and the EnvironmentSurfaces, Coatings and Films
Abstract
Thermal energy storage (TES) systems are significant to solve inevitable intermittency and curtailment issues of clean renewable energy sources. Thus, the high-density and high-efficient TES technologies are required to achieve carbon neutrality. This study aims to synthesize an egg-carton-shaped paraffin microsheet for high-density latent heat storage. Poly(methyl methacrylate) (PMMA) microparticles (3 μm in diameter) are homogeneously placed onto a silicon wafer (10 × 10 mm2) via Langmuir–Blodgett technique. The PMMA monolayer on the silicon wafer is then dipped in a colloidal silica sol and dried to form the bottom structure of the egg-carton. Paraffin, a phase change material with a large melting enthalpy, is injected into the void space of the egg-carton produced by the decomposition of the PMMA particles. Finally, the upper silica shell covers the egg-carton structure with spherical paraffin to ultimately obtain an approximately 3.4-μm-thick microsheet for latent heat storage. The thermal performance of the paraffin microsheets is evaluated using differential scanning calorimetry. The encapsulation ratio, defined as the mass ratio of the paraffin to the microsheet, is calculated to be approximately 80.2%. This novel paraffin microsheet enables an increase in the TES capacity and ultimately overcomes poor heat transfer in paraffin owing to its low thermal conductivity.
ISSN
0927-0248
Language
eng
URI
https://dspace.ajou.ac.kr/dev/handle/2018.oak/34099
DOI
https://doi.org/10.1016/j.solmat.2024.112852
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Type
Article
Funding
This work was supported by a grant from the National Research Foundation of Korea (NRF) funded by the Korean government ( MIST ) (No. NRF-2022R1A2C1005622 ). This work was supported by the Korea Electric Power Corporation (Grant number: R21XO01-28 ).
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Jo, Byeongnam 조병남
Department of Mechanical Engineering
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