Ajou University repository

Enhancing heat transfer performance of a two-phase closed thermosyphon using a polymer-coated hydrophobic condenser
  • Seo, Donghyun ;
  • Park, Jinsoo ;
  • Shim, Jaehwan ;
  • Nam, Jeonghyeon ;
  • Shin, Dong Hwan ;
  • Nam, Youngsuk ;
  • Lee, Jungho
Citations

SCOPUS

16

Citation Export

DC Field Value Language
dc.contributor.authorSeo, Donghyun-
dc.contributor.authorPark, Jinsoo-
dc.contributor.authorShim, Jaehwan-
dc.contributor.authorNam, Jeonghyeon-
dc.contributor.authorShin, Dong Hwan-
dc.contributor.authorNam, Youngsuk-
dc.contributor.authorLee, Jungho-
dc.date.issued2021-09-01-
dc.identifier.issn1359-4311-
dc.identifier.urihttps://dspace.ajou.ac.kr/dev/handle/2018.oak/32145-
dc.description.abstractA two-phase closed thermosyphon (TPCT) is a passive heat transfer device that transfers heat from one point to another by two-phase fluid circulation. Dropwise condensation on a hydrophobic surface, where discrete droplets grow on a condenser surface, promises higher condensation heat transfer coefficients (≈40–70 kW/m2⋅K) than conventional filmwise condensation. Recent researchers have investigated the effect of dropwise condensation on the heat transfer performance of a TPCT. However, their measured condenser heat transfer coefficients (<25 kW/m2⋅K) were much lower than expected, and the heat transfer enhancement mechanism of a hydrophobic TPCT has not been investigated in depth. Here, we achieved a higher condenser heat transfer coefficient of ~66 kW/m2⋅K in a TPCT using a polymer-based hydrophobic coating film and investigated the heat transfer enhancement mechanism by performing experiments and analytical models. A thin polymer film with an optimized thickness (≈60 nm) was combined with adhesion promoter layers to achieve stable and high-performance dropwise condensation consisting of enhanced surface roughness and a coupling agent. The internal two-phase flow patterns and condensation behaviors were systematically evaluated for the heat transfer performance, which was compared to untreated bare and CuO nanostructured superhydrophobic surfaces. We revealed that rapid droplet removal and active re-nucleation on the polymer-coated hydrophobic surface in a TPCT led to 6 times higher condenser heat transfer coefficients and 68–74% smaller overall thermal resistance than those of the bare and superhydrophobic TPCTs. These results are helpful to understand the effect of dropwise condensation on the heat transfer performance of a TPCT and provide a direction for developing more efficient TPCTs.-
dc.description.sponsorshipThis work was supported by the National Research Foundation of Korea (NRF) grant funded by the Ministry of Science and ICT, Korea (No. NRF-2020R1A2C3008689, NRF-2019R1A2C2004607). D.S. acknowledges the support from the Postdoctoral Research Fellowship for Young Scientists at the National Research Council of Science & Technology (NST) in South Korea.-
dc.language.isoeng-
dc.publisherElsevier Ltd-
dc.subject.meshCondenser heat-
dc.subject.meshDropwise condensation-
dc.subject.meshHeat transfer enhancement mechanism-
dc.subject.meshHeat transfer performance-
dc.subject.meshHeat-transfer coefficients-
dc.subject.meshHydrophobic surfaces-
dc.subject.meshHydrophobics-
dc.subject.meshThermal-
dc.subject.meshThermosiphon-
dc.subject.meshTwo-phase closed thermosyphon-
dc.titleEnhancing heat transfer performance of a two-phase closed thermosyphon using a polymer-coated hydrophobic condenser-
dc.typeArticle-
dc.citation.titleApplied Thermal Engineering-
dc.citation.volume196-
dc.identifier.bibliographicCitationApplied Thermal Engineering, Vol.196-
dc.identifier.doi10.1016/j.applthermaleng.2021.117350-
dc.identifier.scopusid2-s2.0-85110614624-
dc.identifier.urlhttp://www.journals.elsevier.com/applied-thermal-engineering/-
dc.subject.keywordCondensation-
dc.subject.keywordHeat pipe-
dc.subject.keywordHeat transfer-
dc.subject.keywordHydrophobic-
dc.subject.keywordThermal resistance-
dc.subject.keywordThermosyphon-
dc.description.isoafalse-
dc.subject.subareaEnergy Engineering and Power Technology-
dc.subject.subareaMechanical Engineering-
dc.subject.subareaFluid Flow and Transfer Processes-
dc.subject.subareaIndustrial and Manufacturing Engineering-
Show simple item record

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Lee, Jungho  Image
Lee, Jungho 이정호
Department of Mechanical Engineering
Read More

Total Views & Downloads

File Download

  • There are no files associated with this item.