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Plasticized polystyrene by addition of -diene based molecules for defect-less CVD graphene transferoa mark
  • Nasir, Tuqeer ;
  • Kim, Bum Jun ;
  • Hassnain, Muhammad ;
  • Lee, Sang Hoon ;
  • Jeong, Byung Joo ;
  • Choi, Ik Jun ;
  • Kim, Youngho ;
  • Yu, Hak Ki ;
  • Choi, Jae Young
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Publication Year
2020-08-01
Publisher
MDPI AG
Citation
Polymers, Vol.12
Keyword
Flexible polymer filmGraphene transferPolymer functionalizationPolymer plasticizationPolystyrene
Mesh Keyword
Chemical vapor depositions (CVD)Critical stepsMetal substratePolymer removalPolymer supportsScale transferStructural supportTransfer process
All Science Classification Codes (ASJC)
Chemistry (all)Polymers and Plastics
Abstract
Chemical vapor deposition of graphene on transition metals is the most favored method to get large scale homogenous graphene films to date. However, this method involves a very critical step of transferring as grown graphene to desired substrates. A sacrificial polymer film is used to provide mechanical and structural support to graphene, as it is detached from underlying metal substrate, but, the residue and cracks of the polymer film after the transfer process affects the properties of the graphene. Herein, a simple mixture of polystyrene and low weight plasticizing molecules is reported as a suitable candidate to be used as polymer support layer for transfer of graphene synthesized by chemical vapor deposition (CVD). This combination primarily improves the flexibility of the polystyrene to prevent cracking during the transfer process. In addition, the polymer removal solvent can easily penetrate between the softener molecules, so that the polymer film can be easily dissolved after transfer of graphene, thereby leaving no residue. This facile method can be used freely for the large-scale transfer of 2D materials.
ISSN
2073-4360
Language
eng
URI
https://dspace.ajou.ac.kr/dev/handle/2018.oak/31519
DOI
https://doi.org/10.3390/polym12081839
Fulltext

Type
Article
Funding
Funding: This research was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF), funded by the Ministry of Science, ICT & Future Planning (NRF-2019R1A2C1006972, NRF-2020R1A2C2010984) Conflicts of Interest: The authors declare no conflict of interest. The funders had no role in the design of the study; in the collection, analyses, or interpretation of data; in the writing of the manuscript, or in the decision to publish the results.
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Yu, Hak Ki류학기
Department of Materials Science Engineering
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