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DC Field | Value | Language |
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dc.contributor.author | Kim, Taewi | - |
dc.contributor.author | Lee, Taemin | - |
dc.contributor.author | Lee, Gunhee | - |
dc.contributor.author | Choi, Yong Whan | - |
dc.contributor.author | Kim, Sang Moon | - |
dc.contributor.author | Kang, Daeshik | - |
dc.contributor.author | Choi, Mansoo | - |
dc.date.issued | 2018-03-03 | - |
dc.identifier.issn | 2076-3417 | - |
dc.identifier.uri | https://dspace.ajou.ac.kr/dev/handle/2018.oak/30115 | - |
dc.description.abstract | In mechanical sensory systems, encapsulation is one of the crucial issues to take care of when it comes to protection of the systems from external damage. Recently, a new type of a mechanical strain sensor inspired by spider's slit organ has been reported, which has incredibly high sensitivity, flexibility, wearability, and multifunctional sensing abilities. In spite of many of these advantages, the sensor is still vulnerable in harsh environments of liquids and/or high temperature, because it has heat-vulnerable polyethylene terephthalate (PET) substrate without any encapsulation layer. Here, we present a mechanical crack-based strain sensor with heat, water and saline solution resistance by alternating the substrate from polyester film to polyimide film and encapsulating the sensor with polyimide. We have demonstrated the ability of the encapsulated crack-based sensor against heat, water, saline solution damage through experiments. Our sensor exhibited reproducibility and durability with high sensitivity to strain (gauge factor above 10,000 at strain of two percent). These results show a new potential of the crack-based sensory system to be used as a wearable voice/motion/pulse sensing device and a high-temperature strain sensor. | - |
dc.description.sponsorship | Daeshik Kang and Sang Moon Kim acknowledge financial support by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (2016R1C1B1009689 and 2016R1C1B1014564). Daeshik Kang acknowledges financial support by the new faculty research fund of Ajou University, the Ajou University research fund and the Nature-Inspired Innovative Technology Development Program through the National Research Foundation of Korea (NRF), which is funded by the Ministry of Science and ICT (NRF-2017M3C1B7014222). Mansoo Choi acknowledges financial support by the Global Frontier R&D Program of the Center for Multiscale Energy Systems (No. 2012M3A6A7054855) funded by the National Research Foundation (NRF) of Korea. | - |
dc.description.sponsorship | Acknowledgments: Daeshik Kang and Sang Moon Kim acknowledge financial support by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (2016R1C1B1009689 and 2016R1C1B1014564). Daeshik Kang acknowledges financial support by the new faculty research fund of Ajou University, the Ajou University research fund and the Nature-Inspired Innovative Technology Development Program through the National Research Foundation of Korea (NRF), which is funded by the Ministry of Science and ICT (NRF-2017M3C1B7014222). Mansoo Choi acknowledges financial support by the Global Frontier R&D Program of the Center for Multiscale Energy Systems (No. 2012M3A6A7054855) funded by the National Research Foundation (NRF) of Korea. | - |
dc.language.iso | eng | - |
dc.publisher | MDPI AG | - |
dc.title | Polyimide encapsulation of spider-inspired crack-based sensors for durability improvement | - |
dc.type | Article | - |
dc.citation.title | Applied Sciences (Switzerland) | - |
dc.citation.volume | 8 | - |
dc.identifier.bibliographicCitation | Applied Sciences (Switzerland), Vol.8 | - |
dc.identifier.doi | 10.3390/app8030367 | - |
dc.identifier.scopusid | 2-s2.0-85042770722 | - |
dc.identifier.url | http://www.mdpi.com/2076-3417/8/3/367/pdf | - |
dc.subject.keyword | Crack | - |
dc.subject.keyword | Encapsulation | - |
dc.subject.keyword | Spider inspired | - |
dc.subject.keyword | Strain sensor | - |
dc.subject.keyword | Thin metal film | - |
dc.description.isoa | true | - |
dc.subject.subarea | Materials Science (all) | - |
dc.subject.subarea | Instrumentation | - |
dc.subject.subarea | Engineering (all) | - |
dc.subject.subarea | Process Chemistry and Technology | - |
dc.subject.subarea | Computer Science Applications | - |
dc.subject.subarea | Fluid Flow and Transfer Processes | - |
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