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Showing results 1 to 5 of 5
Effect of integrated copper pad on the performance of boiling-driven wickless thermal ground plane
Moon, Joo Hyun;
Wang, Xiaomeng;
Fadda, Dani;
Shin, Dong Hwan;
Lee, Jungho
;
You, Seung M.
2021-11-25
Applied Thermal Engineering, Vol.199
Elsevier Ltd
Effect of wettability on pool boiling heat transfer with copper microporous coated surface
Wang, Xiaomeng;
Fadda, Dani;
Godinez, Juan;
Lee, Jungho
;
You, Seung M.
2022-09-15
International Journal of Heat and Mass Transfer, Vol.194
Elsevier Ltd
Effects of cover plate wettability on pool boiling heat transfer in a narrow gap
Rukhsar, Aqsa;
Fadda, Dani;
Wang, Xiaomeng;
Lee, Jungho
;
You, Seung M.
2024-04-01
International Journal of Heat and Mass Transfer, Vol.221
Elsevier Ltd
Effects of materials and microstructures on pool boiling of saturated water from metallic surfaces
Godinez, Juan C.;
Cho, Hanlyun;
Fadda, Dani;
Lee, Jungho
;
Park, Seong Jin;
You, Seung M.
2021-07-01
International Journal of Thermal Sciences, Vol.165
Elsevier Masson s.r.l.
Experimental investigation of heat spreading in a wickless and ultrathin thermal ground plane
oa mark
Wang, Xiaomeng;
Moon, Joo Hyun;
Fadda, Dani;
Shin, Dong Hwan;
Lee, Jungho
;
You, Seung M.
2022-03-01
Case Studies in Thermal Engineering, Vol.31
Elsevier Ltd
1
